USB1T20MTCX Fairchild Semiconductor, USB1T20MTCX Datasheet - Page 8

TRANSCEIVER USB 14-TSSOP

USB1T20MTCX

Manufacturer Part Number
USB1T20MTCX
Description
TRANSCEIVER USB 14-TSSOP
Manufacturer
Fairchild Semiconductor
Type
Transceiverr
Datasheet

Specifications of USB1T20MTCX

Number Of Drivers/receivers
1/1
Protocol
USB 2.0
Voltage - Supply
3.3V
Mounting Type
Surface Mount
Package / Case
14-TSSOP
Number Of Receivers
1
Number Of Transmitters
1
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Maximum Data Rate
12 Mbps
Maximum Supply Current
5 mA
Minimum Operating Temperature
- 40 C
Protocol Supported
USB 2.0
Data Rate
12Mbps
Supply Current
5mA
Supply Voltage Range
3V To 3.6V
Driver Case Style
TSSOP
No. Of Pins
14
Operating Temperature Range
-40°C To +85°C
Interface
USB
Termination Type
SMD
Rohs Compliant
Yes
Filter Terminals
SMD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
USB1T20MTCX
Manufacturer:
DALLAS
Quantity:
430
Part Number:
USB1T20MTCX
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
Company:
Part Number:
USB1T20MTCX
Quantity:
2 500
© 2004 Fairchild Semiconductor Corporation
USB1T20 • Rev. 1.0.2
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
B. DIMENSIONS ARE IN MILLIMETERS
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
E. LANDPATTERN STANDARD: SOP65P640X110-14M
A. CONFORMS TO JEDEC REGISTRATION MO-153,
D. DIMENSIONING AND TOLERANCES PER ANSI
F. DRAWING FILE NAME: MTC14REV6
AND TIE BAR EXTRUSIONS
VARIATION AB, REF NOTE 6
Y14.5M, 1982
Figure 10. 14-Lead Thin Shrink Small Outline Package (TSSOP) JEDEC MO-153, 4.4mm Wide
0.43 TYP
8
0.65
R0.09 min
0.45
1.65
1.00
R0.09min
12.00°
TOP & BOTTOM
6.10
www.fairchildsemi.com

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