LTC2856HMS8-1#TRPBF Linear Technology, LTC2856HMS8-1#TRPBF Datasheet - Page 16

• Manufacturer Part Number: LTC2856HMS8-1#TRPBF
• Description: IC TXRX RS485/RS422 8-MSOP
• Manufacturer: Linear Technology
• Type: Transceiverr

Specifications of LTC2856HMS8-1#TRPBF

• Number Of Drivers/receivers: 1/1
• Protocol: RS422, RS485
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

LTC2857-1/LTC2857-2
LTC2858-1/LTC2858-2
PACKAGE DESCRIPTION
16
3.5 0.05
2.15 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
1.65 0.05
(2 SIDES)
(NOTE 6)
0.25 0.05
PIN 1
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
2.38 0.05
(2 SIDES)
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.50
BSC
DD Package
0.675 0.05
0.75 0.05
3.00 0.10
(4 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
1.65 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
0.25 0.05
R = 0.115
TYP
4
5
2.38 0.10
(2 SIDES)
8
1
0.50 BSC
0.38 0.10
(DD) DFN 1203
285678fe