DSPIC33FJ128MC506-I/PT Microchip Technology Inc., DSPIC33FJ128MC506-I/PT Datasheet - Page 354
![no-image](/images/manufacturer_photos/0/4/440/microchip_technology_inc__sml.jpg)
DSPIC33FJ128MC506-I/PT
Manufacturer Part Number
DSPIC33FJ128MC506-I/PT
Description
DSP, 16-Bit, 128KB Flash, 8KB RAM, 53 I/O, TQFP-64
Manufacturer
Microchip Technology Inc.
Type
DSPr
Datasheet
1.DSPIC33FJ64MC506-IPT.pdf
(370 pages)
Specifications of DSPIC33FJ128MC506-I/PT
A/d Inputs
16-Channels, 12-Bit
Comparators
8
Cpu Speed
40 MIPS
Eeprom Memory
0 Bytes
Input Output
53
Interface
CAN, I2C, SPI, UART/USART
Ios
53
Memory Type
Flash
Number Of Bits
16
Package Type
64-pin TQFP
Programmable Memory
128K Bytes
Ram Size
8K Bytes
Timers
9-16-bit, 4-32-bit
Voltage, Range
3-3.6
Lead Free Status / Rohs Status
RoHS Compliant part
Electrostatic Device
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ128MC506-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- Current page: 354 of 370
- Download datasheet (6Mb)
dsPIC33F
27.2
The following sections give the technical details of the
packages.
64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS70165E-page 352
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Package Details
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
e
b
c
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 2 3
D
D1
L
Dimension Limits
Preliminary
E1
NOTE 2
Units
D1
A2
A1
L1
E1
N
A
E
D
e
L
c
b
E
A1
A
0.95
0.05
0.45
0.09
0.17
MIN
11°
11°
0°
–
MILLIMETERS
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.50 BSC
1.00 REF
L1
NOM
1.00
0.60
0.22
3.5°
12°
12°
64
–
–
–
Microchip Technology Drawing C04-085B
© 2007 Microchip Technology Inc.
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
A2
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