PIC16C74B-20/P Microchip Technology Inc., PIC16C74B-20/P Datasheet - Page 121
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PIC16C74B-20/P
Manufacturer Part Number
PIC16C74B-20/P
Description
40 PIN, 7 KB OTP, 192 RAM, 33 I/O
Manufacturer
Microchip Technology Inc.
Datasheet
1.PIC16C74B-20P.pdf
(184 pages)
Specifications of PIC16C74B-20/P
A/d Inputs
8-Channel, 8-Bit
Cpu Speed
5 MIPS
Eeprom Memory
0 Bytes
Input Output
33
Interface
I2C/SPI/USART
Memory Type
OTP
Number Of Bits
8
Package Type
40-pin PDIP
Programmable Memory
7K Bytes
Ram Size
192 Bytes
Speed
4 MHz
Timers
2-8-bit, 1-16-bit
Voltage, Range
2.5-5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part
Electrostatic Device
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Quantity
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Note 1: This is the limit to which V
PIC16LC63A/65B/73B/74B-04
‡
‡
D100
D101
D102
Param
PIC16C63A/65B/73B/74B-04
PIC16C6A/65B/73B/74B-20
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and
‡ When specification values of standard devices differ from those of extended voltage devices, they are shown in gray.
2000 Microchip Technology Inc.
No.
are not tested.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
4: For RC osc mode, current through R
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from character-
6: The
7: When BOR is enabled, the device will operate correctly until the V
8: In RC oscillator mode, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
9: The leakage current on the MCLR/V
10: Negative current is defined as current sourced by the pin.
C
loading and switching rate, oscillator type, internal code execution pattern and temperature also have an impact
on the current consumption. The test conditions for all I
OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to V
MCLR = V
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
the formula Ir = V
ization and is for design guidance only. This is not tested.
added to the base I
PICmicro device be driven with external clock in RC mode.
els represent normal operating conditions. Higher leakage current may be measured at different input voltages.
Sym
C
OSC2
Cb
IO
current is the additional current consumed when this peripheral is enabled. This current should be
Capacitive Loading
Specs on
Output Pins
OSC2 pin
All I/O pins and OSC2
(in RC mode)
SCL, SDA
(in I
DD
Characteristic
2
C mode)
; WDT enabled/disabled as specified.
DD
DD
/2R
or I
EXT
PD
DD
(mA) with R
measurement.
can be lowered without losing RAM data.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Min
PP
–
–
–
EXT
pin is strongly dependent on the applied voltage level. The specified lev-
EXT
is not included. The current through the resistor can be estimated by
Typ†
PIC16C63A/65B/73B/74B
in kOhm.
–
–
–
Max
400
15
50
DD
-40°C
-40°C
-40°C
measurements in active operation mode are:
Units
0°C
0°C
pF
pF
pF
In XT, HS and LP modes when external
clock is used to drive OSC1
BOR
T
T
T
T
T
A
A
A
A
A
voltage trip point is reached.
+125°C
+70°C
+85°C
+70°C
+85°C
DD
Conditions
,
for commercial
for industrial
for commercial
for industrial
for extended
DD
DS30605C-page 121
and V
SS
.