21490 AIM Solder, 21490 Datasheet - Page 2

• Manufacturer Part Number: 21490
• Description: NC257MD No Clean, SAC305, for MYDATA MY500 Jet Printer
• Manufacturer: AIM Solder

Specifications of 21490

• Alloy: SAC305
• Color: Gray, Smooth, Creamy
• Melting, Point: 217°C to 218°C
• Odor: Typical rosin
• Physical State: Solid
• Primary Type: Solder Paste
• Shelf Life: At 4°C - 12°C — 6 months
• Special Features: 12 - 14 Hour Tack Time
• Time, Setting: Low Density Boards to 150°C — 75 seconds, from 150°C to 175°C — 30-60 seconds, Peak 230° to 245C — 45-75 seconds High Density Boards to 150°C — 90 seconds, from 150°C to 175°C — 60-90 seconds, Peak 230° to 245C — 45-75 seconds
• Viscosity: Suitable for MY500 Jet Printers
• Lead Free Status / Rohs Status: RoHS Compliant part

NC257MD Compatible Products:
-
-
-
Cleaning:
-
-
Handling and Storage:
-
-
Physical Properties:
Test Data Summary:
The information contained herein is based on data considered accurate and is offered at no charge. Product information is based upon the assumption of
proper handling and operating conditions. All information pertaining to solder paste is produced with 45-micron powder. Liability is expressly
disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. Please refer to
http://www.aimsolder.com/terms.cfm
CLASSIFICATION
POWDER TESTING
No.
1
2
FLUX MEDIUM TESTING
No.
1
2
3
4
5
6
7
8
9
SOLDER PASTE TESTING
No.
1
2
3
4
5
6
Product Name
AIM Lead-Free Electropure Solder Bar
NC264-5 No-Clean Flux Spray/Foam
NC270WR VOC-Free No-Clean Spray Flux
NC257MD can be cleaned if necessary with saponified water or an appropriate solvent cleaner.
Please refer to the AIM cleaner matrix for a list of compatible cleaning materials.
NC257MD has a refrigerated shelf life of 6 months at 4
Allow the solder paste to warm up completely and naturally to ambient temperature (4 hrs.) prior to use.
NC257MD
Melting Point
Particle Size
Appearance
Americas [phone] · Europe [phone] · Asia-Pacific [phone] · [e-mail] · www.aimsolder.com
ITEM
Alloy
Item
Powder Size
Powder Shape
Item
Acid Value
Halide Content
Fluorides Spot Test
Corrosivity Test/ Copper Mirror
Corrosion Flux
Halide-Free/Silver Chromate Paper Test
Surface Insulation Resistance
Telcordia (Bellcore) SIR
Telcordia (Bellcore) Electromigration
Item
Tack Test
Tack Test
Solder Ball Test
Wetting Test
Paste Shelf Life
Solder Paste Slump Test
IPC Classification to J-STD-004
to review AIM's terms and conditions.
REL0
Gray, Smooth, Creamy
SPECIFICATION
217° - 218°C
SAC305
T5
Manufacturing and Distribution Worldwide
AIM
Results
Spherical
Results
> 1E9Ω at 96 and 168 h.- pass
> No dendrite growth or corrosion, after a visual
inspection - pass
35°C, 85% 4 days
Initial: 8.43E+12Ω,
Requirement > 1.0E+10Ω - pass
65°C, 85% 500 hrs
Initial: 1.94E+10Ω,
Rƒ/Ri > 0.01 - pass
Results
Type 5 – 25-15 microns
150.2 mg KOH/ g flux
< 300 PPM
No fluoride
Low
Pass
Pass
32.8 g
94.8 g
Pass
Pass
4° - 12°C (40° - 55°F) = 6 months
Pass
IS
- Glowcore No-Clean Cored Wire
- NC No-Clean Tacky Flux
- 200AX Stencil Cleaner
ISO9001:2000 C
°
Copper Mirror to J-STD-004
C - 12° C (40
Final : 8.03E+12Ω
Final : 2.08E+10Ω
ERTIFIED
LOW
AIM Part Number
Metal Loading
Packaging
Viscosity
ITEM
°
F - 55° F).
Suitable for MY500 Jet Printers
Test Method
IPC TM 650 2.2.14
Microscope
Test Method
J-STD-004 IPC TM 650 2.3.35.1
J-STD-004 IPC TM 650 2.3.35.2
J-STD-004 IPC TM 650 2.3.33
J-STD-004 IPC TM 650 2.6.3.3
GR-78-CORE
GR-78-CORE
Test Method
J-STD-005 IPC TM 650 2.4.44
JIS Z 3284 Annez 9
J-STD-004 IPC TM 650 2.3.13
J-STD-004 IPC TM 650 2.3.35
J-STD-004 IPC TM 650 2.3.32
J-STD-004 IPC TM 650 2.6.15
J-STD-005 IPC TM 650 2.4.43
J-STD-005 IPC TM 650 2.4.45
AIM TM 125-11
J-STD-005 IPC TM 650 2.4.35
Iwashita 30cc Syringes
- One-Step Underfill 688
- 4044 Chip Bonding Epoxy
Silver Chromate to J-STD-004
SPECIFICATION
21493
86%
PASS
09/09 Rev 2