LT6301CFE#PBF Linear Technology, LT6301CFE#PBF Datasheet - Page 15

• Manufacturer Part Number: LT6301CFE#PBF
• Description: IC XDSL LINE DRIVER DUAL 28TSSOP
• Manufacturer: Linear Technology
• Type: Driverr

Specifications of LT6301CFE#PBF

• Number Of Drivers/receivers: 2/0
• Protocol: xDSL
• Voltage - Supply: 5 V ~ 12 V
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP Exposed Pad, 28-eTSSOP, 28-HTSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

SI PLIFIED SCHE ATIC
PACKAGE DESCRIPTIO
W
6.60 0.10
4.50 0.10
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
RECOMMENDED SOLDER PAD LAYOUT
(.0036 – .0079)
0.09 – 0.20
–IN
V
V
+
–
W
SEE NOTE 4
(.298)
MILLIMETERS
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
7.56
(INCHES)
(.169 – .177)
4.30 – 4.50*
(.018 – .030)
0.45 – 0.75
Q1
U
0.65 BSC
Q2
(one amplifier shown)
0.45 0.05
Q3
Q4
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
4. RECOMMENDED MINIMUM PCB METAL SIZE
(.120)
3.05
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
28-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Q11
Q9
FOR EXPOSED PAD ATTACHMENT
1.05 0.10
R1
Exposed Pad Variation EA
Q7
Q8
0 – 8
Q10
Q12
PAD HEAT SINK
ON BOTTOM OF
FE Package
Q6
EXPOSED
PACKAGE
Q5
(.0256)
0.65
BSC
28 2726 25 24 23
1
(.0077 – .0118)
0.195 – 0.30
C1
C2
+IN
2
3 4 5 6 7 8 9 10 11 12 13 14
Q16
Q13
Q14
Q15
(.378 – .386)
9.60 – 9.80*
(.298)
22 21
7.56
Q17
Q18
6301
20
SS
19
18 17
OUT
16
15
(.002 – .006)
0.05 – 0.15
FE28 (EA) TSSOP 0203
(.047)
(.120)
1.20
MAX
3.05
LT6301
6.40
BSC
sn6301 6301f
15