ISP1105WTM ST-Ericsson Inc, ISP1105WTM Datasheet - Page 23

• Manufacturer Part Number: ISP1105WTM
• Description: IC TXRX SERIAL BUS ADV 16HBCC
• Manufacturer: ST-Ericsson Inc
• Type: Transceiverr

Specifications of ISP1105WTM

• Number Of Drivers/receivers: 1/1
• Protocol: USB 2.0
• Voltage - Supply: 4 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 16-HBCC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ISP1105W-T; ISP1105W-T

Philips Semiconductors
16. Soldering
9397 750 11231
Product data
16.1 Introduction to soldering surface mount packages
16.2 Reflow soldering
16.3 Wave soldering
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is recommended. In these situations
reflow soldering is recommended.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270 C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
•
•
•
below 225 C (SnPb process) or below 245 C (Pb-free process)
below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness
– for packages with a thickness < 2.5 mm and a volume
thick/large packages.
Rev. 08 — 19 February 2004
2.5 mm
3
so called small/thin packages.
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Advanced USB transceivers
ISP1105/1106
350 mm
3
so called
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