TJA1041T/V,512 NXP Semiconductors, TJA1041T/V,512 Datasheet - Page 25
![IC TXRX CAN HS 5.25V 14-SOIC](/photos/6/57/65749/14-soic-sot108-1_sml.jpg)
TJA1041T/V,512
Manufacturer Part Number
TJA1041T/V,512
Description
IC TXRX CAN HS 5.25V 14-SOIC
Manufacturer
NXP Semiconductors
Type
Transceiverr
Datasheet
1.TJA1041TVM518.pdf
(26 pages)
Specifications of TJA1041T/V,512
Number Of Drivers/receivers
1/1
Protocol
CAN
Voltage - Supply
4.75 V ~ 5.25 V
Mounting Type
Surface Mount
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935286694512
TJA1041T/V
TJA1041T/V
TJA1041T/V
TJA1041T/V
NXP Semiconductors
17. Legal information
17.1 Data sheet status
[1]
[2]
[3]
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
17.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
18. Contact information
For additional information, please visit:
For sales office addresses, send an email to:
TJA1041_6
Product data sheet
Document status
Objective [short] data sheet
Preliminary [short] data sheet
Product [short] data sheet
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
[1][2]
Product status
Development
Qualification
Production
[3]
http://www.nxp.com
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Rev. 06 — 5 December 2007
salesaddresses@nxp.com
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Bare die — All die are tested on compliance with all related technical
specifications as stated in this data sheet up to the point of wafer sawing for a
period of ninety (90) days from the date of delivery by NXP Semiconductors.
If there are data sheet limits not guaranteed, these will be separately
indicated in the data sheet. There are no post-packing tests performed on
individual die or wafers.
NXP Semiconductors has no control of third party procedures in the sawing,
handling, packing or assembly of the die. Accordingly, NXP Semiconductors
assumes no liability for device functionality or performance of the die or
systems after third party sawing, handling, packing or assembly of the die. It
is the responsibility of the customer to test and qualify their application in
which the die is used.
All die sales are conditioned upon and subject to the customer entering into a
written die sale agreement with NXP Semiconductors through its legal
department.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
High speed CAN transceiver
© NXP B.V. 2007. All rights reserved.
TJA1041
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