8111 AIM Solder, 8111 Datasheet - Page 2

• Manufacturer Part Number: 8111
• Description: ONE-STEP Underfill 688; 10 cc; No-Flow Underfill Flip Chip; CSP; BGA; and MICRO-BGA
• Manufacturer: AIM Solder

Specifications of 8111

• Color: Purple when not cured Clear when cured
• Physical State: Liquid
• Special Features: Flows at 120°C — 140°C
• Specific Gravity: 1.27 g/cc
• Temperature Range: Maximum at 255°C
• Time, Setting: Up to 150°C — ≤ 75 seconds, From 150°C to 175°C — 30-60 seconds, Peak Temperature 235°C to 250°C — 60 seconds
• Volatile: total is < 1%
• Lead Free Status / Rohs Status: RoHS Compliant part

Recommended Dispense Pattern
Recommended Reflow Profile
Physical Properties
Corrosion Testing
RATE OF
RISE 2°C /
SEC MAX
Reference
Halide IPC-TM-650 method 2.3.33
Corrosion IPC-TM-650 method 2.6.15
Corrosion IPC-TM-650 method 2.6.15
RAMP TO
150°C
(302°F)
≤ 75
SECONDS
Appearance
CTE (before Tg)
CTE (after Tg)
Tg
Total Volatiles
Specific Gravity @25° C
PROGRESS
THROUGH
150°C-175°C
(302°F-347°F)
30-60
SECONDS
Parameter
Test Coupon
Silver Chromate Paper
Pure Copper
Pure Copper
TO PEAK
TEMP 235°C-
250°C (455°F-
483°F)
45-75
SECONDS
Purple when not cured
Clear when cured
62.7 ppm
174.6 ppm
64.1 C
<1%
1.27 g/cc
TIME ABOVE
217°C (422°F)
60 ± 15
SECONDS
Value
Condition
N/A
40 ± 1°C and
93 ± 2% RH
40 ± 1°C and
93 ± 2% RH
COOLDOWN
≤ 4 °C / SEC
45± 15
SECONDS
PROFILE
LENGTH
AMBIENT TO
PEAK
2.75-3.5
MINUTES
Pass
Pass
Pass
Results