MCP6V06-E/SN Microchip Technology Inc., MCP6V06-E/SN Datasheet - Page 7

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MCP6V06-E/SN

Manufacturer Part Number
MCP6V06-E/SN
Description
Op-Amp, Auto-Zeroed, Single, High DC Precision, -40 to 125 C, SOIC-8
Manufacturer
Microchip Technology Inc.
Datasheet

Specifications of MCP6V06-E/SN

Amplifier Type
Auto-Zeroed, Low Offset Voltage, Low Power, Low Voltage, Precision, Rail-to-Rail, Single Supply
Bandwidth
1.3 MHz
Common Mode Rejection Ratio
106
Current, Input Bias
+1500 pA
Current, Input Offset
-85 pA
Current, Output
±30 mA
Current, Supply
±30 mA
Number Of Amplifiers
Single
Package Type
SOIC-8
Slew Rate
0.5
Temperature, Operating, Range
-40 to +125 °C
Voltage, Gain
147 dB
Voltage, Input
1.5 to 2.1 V
Voltage, Noise
52 nV/sqrt Hz
Voltage, Offset
+3 μV
Voltage, Output, High
1785 mV
Voltage, Output, Low
1785 mV
Voltage, Supply
1.8 to 5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP6V06-E/SN
Manufacturer:
MICROCHIP
Quantity:
12 000
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2008 Microchip Technology Inc.
PART NO.
Device:
Temperature Range:
Package:
Device
Temperature
Range
–X
MCP6V06
MCP6V06T Single Op Amp
MCP6V07
MCP6V07T Dual Op Amp
MCP6V08
MCP6V08T Single Op Amp with Chip Select
E
MD
MNY * = Plastic Dual Flat, No-Lead (2×3x0.75 mm), 8-lead
SN
* Y = nickel palladium gold manufacturing designator. Only
= -40°C to +125°C
= Plastic Dual Flat, No-Lead (4×4x0.9 mm), 8-lead
= Plastic SOIC (150mil Body), 8-lead
(MCP6V07 only)
(MCP6V06, MCP6V08)
available on the TDFN package.
Package
Single Op Amp
(Tape and Reel for 2x3 TDFN and SOIC)
Dual Op Amp
(Tape and Reel for 4×4 DFN and SOIC)
Single Op Amp with Chip Select
(Tape and Reel for SOIC)
/XXX
Examples:
a)
b)
a)
b)
a)
b)
MCP6V06T-E/SN: Extended temperature,
MCP6V06-E/MNY: Extended temperature,
MCP6V07-E/MD:
MCP6V07T-E/SN: Tape and Reel,
MCP6V08-E/SN:
MCP6V08-E/MNY:Extended temperature,
MCP6V06/7/8
.
8LD 2x3 TDFN package.
8LD SOIC package.
8LD 2x3 TDFN package.
Extended temperature,
8LD 4x4 DFN package..
Extended temperature,
8LD SOIC package.
Extended temperature,
8LD SOIC package.
DS22093B-page 41

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