DS90LV011AHMFX/NOPB National Semiconductor, DS90LV011AHMFX/NOPB Datasheet - Page 2

• Manufacturer Part Number: DS90LV011AHMFX/NOPB
• Description: IC DRIVER LVDS DIFF 3V SOT23-5
• Manufacturer: National Semiconductor
• Type: Driverr

Specifications of DS90LV011AHMFX/NOPB

• Number Of Drivers/receivers: 1/0
• Protocol: RS644
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Package / Case: SOT-23-5, SC-74A, SOT-25
• Number Of Elements: 1
• Number Of Receivers: 1
• Number Of Drivers: 1
• Input Type: CMOS/TTL
• Operating Supply Voltage (typ): 3.3V
• Differential Output Voltage: 450mV
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 5
• Package Type: SOT-23
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: DS90LV011AHMFX

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|V
∆V
V
∆V
I
I
I
C
V
V
I
I
V
C
I
t
t
t
t
t
t
t
f
Symbol
OFF
OS
OSD
IH
IL
DD
PHLD
PLHD
SKD1
SKD3
SKD4
TLH
THL
MAX
Symbol
OS
IH
IL
CL
OUT
IN
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Notes 2, 3, 8)
Switching Characteristics
Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified. (Notes 3, 5, 6, 7)
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except V
Note 3: All typicals are given for: V
OD
Supply Voltage (V
LVCMOS input voltage (TTL IN)
LVDS output voltage (OUT
LVDS output short circuit current
Maximum Package Power Dissipation
Storage Temperature
Lead Temperature Range Soldering
OD
OS
MF Package
Derate MF Package
Thermal resistance (θ
(4 sec.)
|
Output Differential Voltage
V
Offset Voltage
Offset Magnitude Change
Power-off Leakage
Output Short Circuit Current
(Note 4)
Differential Output Short Circuit
Current (Note 4)
Output Capacitance
Input High Voltage
Input Low Voltage
Input High Current
Input Low Current
Input Clamp Voltage
Input Capacitance
Power Supply Current
Differential Propagation Delay High to Low
Differential Propagation Delay Low to High
Differential Pulse Skew |t
Differential Part to Part Skew (Note 10)
Differential Part to Part Skew (Note 11)
Transition Low to High Time
Transition High to Low Time
Maximum Operating Frequency (Note 12)
OD
Magnitude Change
DD
Parameter
)
JA
)
±
DD
)
Parameter
= +3.3V and T
7.22 mW/˚C above +25˚C
PHLD
@
− t
−65˚C to +150˚C
+25˚C
A
−0.3V to +3.6V
−0.3V to +3.9V
PLHD
= +25˚C.
R
(Figure 1 and Figure 2)
R
(Figure 1)
V
V
V
V
V
I
No Load
R
−0.3V to +4V
138.5˚C/Watt
CL
OUT
OUT+
OD
IN
IN
L
L
L
(Note 1)
= 100Ω
= 100Ω
= 100Ω
| (Note 9)
= −18 mA
= 3.3V or 2.4V
= GND or 0.5V
= 0V
902 mW
+260˚C
= 3.6V or GND, V
and V
24mA
Conditions
OUT−
V
2
IN
R
(Figure 3 and Figure 4)
= 0V
L
= V
= 100Ω, C
Recommended Operating
Conditions
Supply Voltage (V
Temperature (T
Maximum Junction
Temperature
ESD Ratings
DD
DD
HBM (1.5 kΩ, 100 pF)
EIAJ (0 Ω, 200 pF)
CDM (0 Ω, 0 pF)
IEC direct (330 Ω, 150 pF)
Conditions
or GND
= 0V
L
= 15 pF
A
TTL IN
OUT+,
)
OUT−
V
DD
Pin
DD
)
Min
200
0.3
0.3
0.2
0.2
1.125
GND
−1.5
0
0
0
Min
250
2.0
Min
−40
3.0
0
Typ
Typ
250
+25
1.0
1.1
0.1
0.2
0.4
0.5
0.5
3.3
1.22
−0.6
Typ
350
±
−6
−5
±
±
3
1
3
3
5
7
1
2
1
+125
Max
3.6
1.375
Max
Max
1.5
1.5
0.7
1.0
1.2
1.0
1.0
V
450
±
−24
−12
±
±
0.8
35
25
10
8
10
DD
10
10
≥ 2000V
+150˚C
≥ 900V
Units
≥ 9kV
≥ 4kV
OD
˚C
V
Units
Units
MHz
.
mV
mV
mV
mA
mA
mA
mA
µA
pF
µA
µA
pF
ns
ns
ns
ns
ns
ns
ns
V
V
V
V