MAX6897PAZT+T Maxim Integrated Products, MAX6897PAZT+T Datasheet - Page 2

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MAX6897PAZT+T

Manufacturer Part Number
MAX6897PAZT+T
Description
Supervisory Circuits Adjustable Sequencer/Supervisor
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of MAX6897PAZT+T

Lead Free Status / Rohs Status
Lead free / RoHS Compliant
ABSOLUTE MAXIMUM RATINGS
OUT, OUT (push-pull) ................................-0.3V to (V
OUT, OUT (open-drain)..........................................-0.3V to +30V
CDELAY......................................................-0.3V to (V
Output Current (all pins) ...................................................±20mA
Continuous Power Dissipation (T
Ultra-Small, Adjustable
Sequencing/Supervisory Circuits
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
otherwise noted.) (Note 2)
2
SUPPLY
Operating Voltage Range
Undervoltage Lockout (Note 3)
V
IN
Threshold Voltage
Hysteresis
Input Current (Note 4)
CDELAY
Delay Charge Current
Delay Threshold
CDELAY Pulldown Resistance
ENABLE/ENABLE
Input Low Voltage
Input High Voltage
Input Leakage Current
V
6-Pin Thin SOT23 (derate 9.1mW/°C above +70°C) ...727.3mW
CC
CC
6-Pin µDFN (derate 2.1mW/°C above +70°C)...........167.7mW
CC
_______________________________________________________________________________________
, ENABLE, ENABLE, IN....................................-0.3V to +6V
Supply Current
= 1.5V to 5.5V, T
layer board. For detailed information on package thermal considerations refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
A
= -40°C to +125°C, unless otherwise specified. Typical values are at V
A
= +70°C)
SYMBOL
R
V
CDELAY
UVLO
I
V
V
LEAK
V
I
HYST
I
V
V
I
TCD
CC
CD
CC
IN
TH
IH
IL
V
V
V
V
V
CDELAY rising
ENABLE, ENABLE = V
CC
CC
IN
IN
IN
CC
CC
rising, 1.5V < V
falling
= 0V or V
falling
= 3.3V, no load
+ 0.3V)
+ 0.3V)
CC
CONDITIONS
CC
Package Junction-to-Ambient Thermal Resistance (θ
Package Junction-to-Case Thermal Resistance (θ
Operating Temperature Range .........................-40°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
6-Pin µDFN ..................................................................477°C/W
6-Pin Thin SOT23 ........................................................110°C/W
6-Pin Thin SOT23 ..........................................................50°C/W
CC
< 5.5V
or GND
0.491
1.20
0.95
-100
MIN
CC
200
-15
1.5
1.4
= 3.3V and T
TYP
1.00
250
130
0.5
10
5
A
0.509
+100
MAX
1.35
1.05
+15
300
500
= +25°C, unless
5.5
0.4
20
JC
JA
) (Note 1)
) (Note 1)
UNITS
mV
µA
nA
nA
nA
V
V
V
V
V
V

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