DS1339U-33+ Dallas Semiconductor, DS1339U-33+ Datasheet - Page 19

• Manufacturer Part Number: DS1339U-33+
• Description: SERIAL RTC 3.3V USOP
• Manufacturer: Dallas Semiconductor

Specifications of DS1339U-33+

• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

HANDLING, PCB LAYOUT, AND ASSEMBLY
The DS1339C package contains a quartz tuning-fork crystal. Pick-and-place equipment may be used, but
precautions should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided
to prevent damage to the crystal.
Avoid running signal traces under the package, unless a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connected to ground.
The leaded SO package may be reflowed as long as the peak temperature does not exceed 240°C. Peak reflow
temperature (≥ 230°C) duration should not exceed 10 seconds, and the total time above 200°C should not exceed
40 seconds (30 seconds nominal). Exposure to reflow is limited to 2 times maximum.
The RoHS SO package may be reflowed using a reflow profile that complies with JEDEC J-STD-020 lead-free
assembly.
Moisture-sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package
label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020B standard for
moisture-sensitive device (MSD) classifications.
PIN CONFIGURATIONS
CHIP INFORMATION
TRANSISTOR COUNT: 11,325
PROCESS: CMOS
THERMAL INFORMATION
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to
TOP VIEW
PART
μSOP
SO
PACKAGE TYPE
V
BACKUP
GND
X1
X2
8 μ SOP
16 SO
THETA-J
(°C/W)
μSOP
DS1339
229
73
A
V
SCL
SDA
SQW/INT
CC
THETA-J
(°C/W)
39
23
C
CONDITIONS
PACKAGE CODE
Typical
19 of 20
—
—
TOP VIEW
www.maxim-ic.com/packages
SQW/INT
SCL
V
N.C.
N.C.
N.C.
N.C.
N.C.
CC
SO (300 mils)
DS1339 I
DS1339C
DOCUMENT NO.
2
C Serial Real-Time Clock
SDA
GND
N.C.
N.C.
N.C.
N.C.
N.C.
V
21-0036
21-0042
BACKUP
.