MAX3222ECAP Maxim Integrated Products, MAX3222ECAP Datasheet - Page 15

• Manufacturer Part Number: MAX3222ECAP
• Description: IC TXRX RS232 120KBPS LP 20SSOP
• Manufacturer: Maxim Integrated Products
• Type: Transceiverr

Specifications of MAX3222ECAP

• Number Of Drivers/receivers: 2/2
• Protocol: RS232
• Voltage - Supply: 3 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Figure 6a shows the transmitter output voltages under
increasing load current at +3.0V. Figure 6b shows a
typical mouse connection using the MAX3241E.
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/
MAX3246E maintain the RS-232 ±5V minimum transmit-
ter output voltage even at high data rates. Figure 7
shows a transmitter loopback test circuit. Figure 8
shows a loopback test result at 120kbps, and Figure 9
shows the same test at 250kbps. For Figure 8, all trans-
mitters were driven simultaneously at 120kbps into RS-
232 loads in parallel with 1000pF. For Figure 9, a single
transmitter was driven at 250kbps, and all transmitters
were loaded with an RS-232 receiver in parallel with
1000pF.
The MAX3237E maintains the RS-232 ±5.0V minimum
transmitter output voltage at data rates up to 1Mbps.
Figure 10 shows a loopback test result at 1Mbps with
MBAUD = V
loaded with an RS-232 receiver in parallel with 250pF.
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/
MAX3246E can directly interface with various 5V logic
families, including ACT and HCT CMOS. See Table 3
for more information on possible combinations of inter-
connections.
Table 4. Reliability Test Data
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Temperature Cycle
Operating Life
Moisture Resistance
Low-Temperature Storage
Low-Temperature Operational
Solderability
ESD
High-Temperature Operating
Life
Interconnection with 3V and 5V Logic
TEST
CC
. For Figure 10, all transmitters were
______________________________________________________________________________________
Up to 1Mbps, True RS-232 Transceivers
T
T
T
T
T
T
8-hour steam age
±15kV, Human Body Model
T
A
A
A
A
A
A
J
= +150°C
High Data Rates
= -35°C to +85°C,
= -40°C to +100°C
= +70°C
= +20°C to +60°C, 90% RH
= -20°C
= -10°C
CONDITIONS
The UCSP represents a unique packaging form factor
that may not perform equally to a packaged product
through traditional mechanical reliability tests. UCSP
reliability is integrally linked to the user’s assembly
methods, circuit board material, and usage environ-
ment. The user should closely review these areas when
considering use of a UCSP package. Performance
through Operating Life Test and Moisture Resistance
remains uncompromised as the wafer-fabrication
process primarily determines it.
Mechanical stress performance is a greater considera-
tion for a UCSP package. UCSPs are attached through
direct solder contact to the user’s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be consid-
ered. Table 4 shows the testing done to characterize
the UCSP reliability performance. In conclusion, the
UCSP is capable of performing reliably through envi-
ronmental stresses as indicated by the results in the
table. Additional usage data and recommendations are
detailed in Application Note 1891: Wafer-Level
Packaging (WLP) and Its Applications .
DURATION
150 cycles,
900 cycles
240 hours
240 hours
240 hours
168 hours
24 hours
—
—
UCSP Reliability
FAILURES PER
SAMPLE SIZE
0/200
0/10,
0/10
0/10
0/10
0/10
0/15
0/45
0/5
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