PIC32MX440F128LT-80V/BG Microchip Technology, PIC32MX440F128LT-80V/BG Datasheet - Page 31

• Manufacturer Part Number: PIC32MX440F128LT-80V/BG
• Description: 128 KB Flash, 32 KB RAM, USB-OTG, 80 MHz, 10-Bit ADC, DMA 121 XBGA 10x10x1.20mm
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr

Specifications of PIC32MX440F128LT-80V/BG

• Processor Series: PIC32MX4xx
• Core: MIPS
• Data Bus Width: 32 bit
• Program Memory Type: Flash
• Program Memory Size: 128 KB
• Data Ram Size: 32 KB
• Interface Type: USB, I2C, UART, RS-232, RS-485, SPI
• Maximum Clock Frequency: 80 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 5
• Operating Supply Voltage: 2.3 V to 3.6 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Package / Case: XBGA-121
• Operating Temperature Range: - 40 C to + 105 C
• Supply Current (max): 10 mA
• Core Processor: MIPS32® M4K™
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: I²C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: -
• Eeprom Size: -
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Lead Free Status / Rohs Status: Details

2.0
2.1
Getting started with the PIC32MX3XX/4XX family of
32-bit Microcontrollers (MCUs) requires attention to a
minimal set of device pin connections before
proceeding with development. The following is a list of
pin names, which must always be connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
• V
© 2011 Microchip Technology Inc.
(see
is not used)
(see
(see
Regulator (V
(see
Programming™ (ICSP™) and debugging purposes
(see
source is used
(see
reference for ADC module is implemented
Note:
Note 1: This data sheet summarizes the features
REF
CAP
DD
Section 2.2 “Decoupling
Section 2.2 “Decoupling
Section 2.3 “Capacitor on Internal Voltage
Section 2.4 “Master Clear (MCLR)
Section 2.5 “ICSP
Section 2.8 “External Oscillator
+/V
/V
DD
2: Some registers and associated bits
GUIDELINES FOR GETTING
STARTED WITH 32-BIT
MICROCONTROLLERS
Basic Connection Requirements
CORE
and V
REF
and AV
The AV
connected independent of ADC use and
ADC voltage reference source.
of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to the “PIC32 Family
Reference Manual”, which is available
from
(www.microchip.com/PIC32).
described in this section may not be avail-
able on all devices. Refer to
“Memory Organization”
sheet for device-specific register and bit
information.
- pins used when external voltage
CAP
SS
the
SS
pins
/V
DD
the
CORE
pins (regardless if ADC module
PIC32MX3XX/4XX
and AV
)”)
Pins”)
Microchip
SS
Capacitors”)
Capacitors”)
pins must be
in this data
Pins”)
Section 4.0
web
family
Pin”)
site
of
2.2
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
• Placement on the printed circuit board: The
• Handling high frequency noise: If the board is
• Maximizing performance: On the board layout
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
SS
is required. See
PIC32MX3XX/4XX
Decoupling Capacitors
Figure
2-1.
DD
, V
DS61143H-page 31
SS
, AV
DD
and