STM32W108HBU61TR STMicroelectronics, STM32W108HBU61TR Datasheet - Page 198
STM32W108HBU61TR
Manufacturer Part Number
STM32W108HBU61TR
Description
16/32-BITS MICROS
Manufacturer
STMicroelectronics
Series
STM32r
Specifications of STM32W108HBU61TR
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Applications
IEEE 802.15.4 Wireless
Processing Unit
Microprocessor
Operating Supply Voltage (min)
1.18V
Operating Supply Voltage (typ)
1.25V
Operating Supply Voltage (max)
1.32V
Package Type
VFQFPN EP
Pin Count
40
Mounting
Surface Mount
Rad Hardened
No
Core Processor
ARM® Cortex-M3™
Program Memory Type
FLASH (128 kB)
Controller Series
STM32W
Ram Size
8K x 8
Interface
I²C, SPI, UART/USART
Number Of I /o
18
Voltage - Supply
1.18 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
40-VFQFN Exposed Pad
Lead Free Status / Rohs Status
Compliant
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Electrical characteristics
14.7
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Figure 56
Figure 56. Transmit output power
Digital I/O specifications
Table 53
VDD_PADS) comes from three dedicated pins (Pins 23, 28 and 37). The voltage applied to
these pins sets the I/O voltage.
Table 53.
Voltage supply (Regulator Input) VDD_PADS
Low Schmitt switching threshold
High Schmitt switching
threshold
Input current for logic 0
Input current for logic 1
Input pull-up resistor value
Input pull-down resistor value
lists the digital I/O specifications for the STM32W. The digital I/O power (named
Parameter
shows typical output power against power setting on the ST reference design.
Digital I/O characteristics
Doc ID 16252 Rev 8
V
Schmitt input threshold
going from high to low
V
Schmitt input threshold
going from low to high
I
I
R
R
IL
IH
SWIL
SWIH
IPU
IPD
Conditions
VDD_PADS
VDD_PADS
STM32W108CB, STM32W108HB
0.42 x
0.62 x
Min.
2.1
24
24
–
–
Typ.
29
29
–
–
–
–
–
VDD_PADS
VDD_PADS
0.50 x
0.80 x
Max.
+0.5
-0.5
3.6
34
34
Unit
µA
µA
kΩ
kΩ
V
V
V
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