TC-2810 3M, TC-2810 Datasheet - Page 5

• Manufacturer Part Number: TC-2810
• Description: 3M(TM) Thermally Conductive Adhesive TC-2810, 37 ML Duo-Pak
• Manufacturer: 3M

3M
Storage and Shelf Life
Storage: Store 3M™ Thermally Conductive Epoxy Adhesive TC-2810 at 60-80°F (15-27°C) or refrigerate for maximum
shelf life and to reduce filler settling.
Shelf Life: Epoxy Adhesive TC-2810 has a shelf life of 12 months after date of shipment in its original container.
General Information
Product selection table for 3M™ Thermally Conductive Materials.
Only the “S” versions are available in 0.5 mm thicknesses.
“S” designation signifies a polyester film on one side to provide a non-tacky surface.
“H” designation signifies a product with one one-tacky surface without the use of PET film.
3M™ Thermally Conductive Pads
3M™ Thermally Conductive Pads (Acrylic)
3M™ Thermally Conductive Epoxy Adhesives
3M™ Thermally Conductive Tapes
DP-190 Gray
5516/5516S
5519/5519S
5592/5592S
5595/5595S
™
TC-2707
Product
9889FR
5591S
5598H
5590H
8805
8810
8815
8820
Thermally Conductive Epoxy Adhesive TC-2810
0.5, 1.0, 1.5, 2.0
0.5, 1.0, 1.5, 2.0
0.5, 1.0, 1.5, 2.0
0.5, 1.0, 1.5, 2.0
0.5, 1.0, 1.5, 2.0
0.5, 1.0, 1.5
Thickness
1.0, 1.5
(mm)
0.127
0.375
0.25
0.50
—
—
1.0
Bulk Thermal
Conductivity
(W/m-K)
0.7
0.4
2.3
4.3
1.0
1.1
1.6
2.0
3.0
0.6
0.5
Applications requiring thin bonding with good thermal transfer; CPU, flex
circuit and power transformer bonding to heat sinks and other cooling
devices. Superior tack and wetting properties.
Applications requiring gap filling and bonding with good thermal transfer;
plasma display, IC packages and PCB bonding to heat sinks, metal cases
and other cooling devices.
Applications requiring gap filling and superior thermal performance
without bonding. IC package and PCB thermal interfacing with heat sinks
or other cooling devices and metal cases.
These pads use an acrylic elastomer for applications that require a non-
silicone thermal pad. Provides IC package and PCB thermal interfacing
with heat sinks or other cooling devices, and metal cases.
Applications requiring high adhesive strength, good surface wet-out, gap
filling and good thermal transfer. Provides IC package and PCB thermal
interfacing with heat sinks or other cooling devices.
(5)
Typical Applications