C0510X6S0G224M TDK Corporation, C0510X6S0G224M Datasheet
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C0510X6S0G224M
Specifications of C0510X6S0G224M
Related parts for C0510X6S0G224M
C0510X6S0G224M Summary of contents
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C Series Low ESL Flip Type Type: Issue date: TDK MLCC US Catalog C0510 [EIA CC0204] C0816 [EIA CC0306] C1220 [EIA CC0508] C1632 [EIA CC0612] April 2011 Version B11 ...
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If you intend to use a product listed in this catalog for a purpose that may cause loss of life or other damage, you must contact our company’s sales window may modify products or discontinue production of ...
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Positioning the electrodes along the length of the Features chip device, reduces ESR and ESL components over conventional products. • Provides high frequency noise suppression effect because the resonating frequency is high. • Flipped geometry provides low inductance (less ...
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... Capacitance Range Table Class 2 (Temperature Stable) Temperature Characteristics X6S (-55 to +105ºC, ±22%) TDK Part Number Temperature (Ordering Code) Characteristics C0510X6S0G104M X6S C0510X6S0G224M X6S C0510X6S0G474M X6S TDK MLCC US Catalog X6S 0G (4V) Standard Thickness 0.30 mm Rated Capacitance Voltage (pF) ...
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Capacitance Range Chart Capacitance Range Chart Temperature Characteristics: X7R, (± 15%), X7S (± 22%), X5R (± 15%), X6S (± 22%) Rated Voltage: 16V (1C), 10V (1A), 6.3V (0J), 4V (0G) Capacitance Cap Tolerance (pF) Code 10,000 103 K: ± 10% ...
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Capacitance Range Chart Capacitance Range Chart Temperature Characteristics: X7R, (± 15%), X5R (± 15%) Rated Voltage: 50V (1H), 25V (1E), 16V (1C), 10V (1A), 6.3V (0J) Capacitance Cap Tolerance (pF) Code 10,000 103 K: ± 10% 22,000 223 M: ± ...
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Capacitance Range Chart Capacitance Range Chart Temperature Characteristics: X7R, (± 15%), X7S (± 22%), X5R (± 15%) Rated Voltage: 50V (1H), 25V (1E), 16V (1C), 10V (1A), 6.3 (0J), 4V (0G) Capacitance Cap Tolerance (pF) Code 10,000 103 K: ± ...
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Capacitance Range Table Class 2 (Temperature Stable) Temperature Characteristics X7R (-55 to +125ºC, ±15%), X7S (-55 to +125ºC, ±2%), X5R (-55 to +85ºC, ±15%) TDK Part Number Temperature (Ordering Code) Characteristics C1632X7R1H103K X7R C1632X7R1H223K X7R C1632X7R1H473K X7R C1632X7R1H104K X7R C1632X7R1H224K ...
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... X5S 6 Temperature Capacitance Change (%) Characteristics of Capacitance (Class 2) 7 Robustness of No sign of termination coming off, breakage of ceramic, or other abnormal Terminations signs. TDK MLCC US Catalog C Series – Low ESL Flip Type Rated Voltage D.F. 50V, 25V DC 0.03 max. 16V, 10V, 6.3V 0.05 max. ...
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... No mechanical damage. 9 Solderability New solder to cover over 75% of termination. 25% may have pinholes or rough spots but not concentrated in one spot. Ceramic surface of “A sections” shall not be exposed due to melting or shifting of termination material. 10 Resistance to solder heat External No cracks are allowed and terminations ...
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... Repeat this for 2h each in 3 perpendicular directions. X7R X7S ± 7.5 % X5R X6S Solder the capacitors on P.C. board (shown in Appendix 1) before testing. Expose the capacitor in the conditions step1 through 4 and repeat 5 times consecutively. Change from the Leave the capacitor in ambient conditions for 24 ± 2h value before test before measurement ...
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... Resistance voltage 16, 10, 6.3 and 4V DC, 10MΩ•μF min. *As for the initial measurement of capacitors on number 6, 10, 11, 12 and 13, leave capacitor at 150 -10, 0°C for 1h and measure the value after leaving capacitor for 24 ± ambient condition. TDK MLCC US Catalog C Series – Low ESL Flip Type Test or Inspection Method Solder the capacitors on P ...
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General Specifications Appendix - 1 P.C. Board for reliability test 100 mm c Solder Resist Material : Glass Epoxy ( As per JIS C6484 GE4 ) P.C. Board thickness : Appendix 1,2 Copper ( thickness 0.035mm ) Solder resist TDK ...
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Soldering Information • Recommended Soldering Land Pattern Chip capacitor Solder land Reflow Soldering C0510 C0816 Type [CC0204] [CC0306] Symbol A 0.20 0.30 B 0.20 0.35 C 1.00 1.60 • Recommended Solder Amount Excessive solder Adequate solder Insufficient ...
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Packaging Information • Carrier Tape Configuration Bulk Chips 160mm min. Drawing direction • Peel Back Force (Top Tape) Top cover tape Carrier tape Bottom cover tape (Paper carrier tape of type 2) • Chip Quantity Per Reel and Structure of ...
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... Copper (Cu) Nickel (Ni) Tin (Sn) Page 210 • Environmental Information TDK Corporation established internal product environmental assurance standards that include the six hazardous substances banned by the EU RoHS Directive July 1, 2006 along with additional substances independently banned by TDK and has successfully completed making general purpose electronic components conform to the RoHS Directive ...