GP2S60B Sharp Electronics, GP2S60B Datasheet
![](/photos/31/35/313554/4pin_smt_sml.jpg)
GP2S60B
Specifications of GP2S60B
Available stocks
Related parts for GP2S60B
GP2S60B Summary of contents
Page 1
GP2S60 ■ Description GP2S60 is a compact-package, phototransistor out- put, refl ective photointerrupter, with emitter and detector facing the same direction in a molding that provides non- contact sensing. The compact package series is a result of unique technology, combing ...
Page 2
Internal Connection Diagram Top view ■ Outline Dimensions Top view (0.7) Detector center (0.7) Emitter center 2.7 3.2 Opaque resin molding portion (1. Pattern for directional Distinction (NC) Plating area • Unspecifi ed ...
Page 3
Absolute Maximum Ratings Parameter Forward current Input Reverse voltage Power dissipation Collector-emitter voltage Emitter-collector voltage Output Collector current Collector power dissipation Total power dissipation Operating temperature Storage temperature ∗ 1 Soldering temperature ∗ 1 For 5s or less ■ ...
Page 4
... Model Line-up Model No. Rank GP2S60 GP2S60A A GP2S60B B Please contact a local SHARP sales representative to see the actial status of the produiction μ A) Conditions 130 I = 4mA 130 T = 25˚ GP2S60 Sheet No.: D3-A02101EN ...
Page 5
Fig.1 Forward Current vs. Ambient Temperature Ambient temperature T Fig.3 Forward Current vs. Forward Voltage T =75˚C a 50˚C 25˚C 100 0˚C −25˚ 0.5 1 1.5 ...
Page 6
Fig.7 Collector Dark Current vs. Ambient Temperature − =20V CE −7 10 −8 10 −9 10 − Ambient temperature T Fig.9 Test Circuit for Response Time Reflector V CC Plate ...
Page 7
Fig.13 Detecting Position Characteristics (2) 100 Sensor −3 −2 −1 OMS card moving distance (mm) Remarks : Please be aware that all data in the graph are just for reference and not for ...
Page 8
Design Considerations ● Design guide 1) Regarding to prevention of malfunction To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to the external light. 2) Distance characteristic The distance between the photointerrupter ...
Page 9
Recommended pattern (Unit : mm) 2−1 2−1.7 2−1 area : Please do not apply the pattern wiring to avoid the possibility of short circuit. Regarding amount of solder, if there is solder leakage in terminal wiring pattern between PCB ...
Page 10
Manufacturing Guidelines ● Storage and management after open Storage condition Storage temp 30˚C, Storage humidity : 70%RH or less at regular packaging. Treatment after opening the moisture-proof package After opening, you should mount the products while keeping ...
Page 11
Soldering Method Refl ow Soldering: Refl ow soldering should follow the temperature profi le shown below. Soldering should not exceed the curve of temperature profi le and time. Please solder within one time. MAX 240˚C 200˚C MAX 160˚C 1 ...
Page 12
Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specifi c brominated fl ame retardants such ...
Page 13
Package specifi cation ● Tape and Reel package Package materials Carrier tape : PS (with anti-static material) Cover tape : PET (three layer system) Reel : PS Package method 2 000 pcs of products shall be packaged in a ...
Page 14
Direction of product insertion Storage method Storage conditions should follow the condition shown below. Storage temperature : 5 to 30˚C Storage hunidity : 70%RH or less Pull-out direction 14 GP2S60 [Packing : 2 000pcs/reel] Sheet No.: D3-A02101EN ...
Page 15
Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...