SMAJ28A Taiwan Semiconductor, SMAJ28A Datasheet
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SMAJ28A
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SMAJ28A Summary of contents
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Features For surface mounted application Low profile package Built-in strain relief Glass passivated junction Excellent clamping capability Fast response time: Typically less than 1.0ps from 0 volt to BV min. Typical I less than 1µA above 10V R High temperature ...
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RATINGS AND CHARACTERISTIC CURVES (SMAJ SERIES) FIG.1- PEAK PULSE POWER RATING CURVE 100 0.2" sq 5.0mm COPPER PAD AREAS 0.1 100 0.1 s 1.0 s td. PULSE WIDTH, sec. FIG.3- CLAMPING POWER PULSE WAVEFORM ...
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... SMAJ18A BT 18 SMAJ20 BU 20 SMAJ20A BV 20 SMAJ22 BW 22 SMAJ22A BX 22 SMAJ24 BY 24 SMAJ24A BZ 24 SMAJ26 CD 26 SMAJ26A CE 26 SMAJ28 CF 28 SMAJ28A CG 28 SMAJ30 CH 30 SMAJ30A CK 30 SMAJ33 CL 33 SMAJ33A CM 33 SMAJ36 CN 36 SMAJ36A CP 36 SMAJ40 CQ 40 SMAJ40A CR 40 SMAJ43 CS 43 SMAJ43A ...
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ELECTRICAL CHARACTERISTICS (TA=25 Device Working Peak Device Marking Reverse Code Voltage V (Volts) WM SMAJ45 CU 45 SMAJ45A CV 45 SMAJ48 CW 48 SMAJ48A CX 48 SMAJ51 CY 51 SMAJ51A SMAJ54 RE 54 SMAJ54A SMAJ58 RF ...
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APPLICATION NOTES: Recommended Pad Layout The pad dimensions should be 0.010" longer than the contact size in the lead axis. This allows a solder fillet to form, see figure below. Contact factory for soldering methods. Dimensions in inches and (millimeters) ...