AT24C16C-XHM-B Atmel, AT24C16C-XHM-B Datasheet - Page 21
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AT24C16C-XHM-B
Manufacturer Part Number
AT24C16C-XHM-B
Description
Manufacturer
Atmel
Datasheet
1.AT24C16C-XHM-B.pdf
(24 pages)
Specifications of AT24C16C-XHM-B
Lead Free Status / Rohs Status
Compliant
8719A–SEEPR–9/10
5TS1 – SOT23
Notes:
packagedrawings@atmel.com
Package Drawing Contact:
1. Dimensions D does not include mold flash, protrusions or gate
2. The package top may be smaller than the package bottom.
3. These dimensions apply to the flat section of the lead between 0.08
4. Dimension “b” does not include dambar protrusion. Allowable
5. This drawing is for general information only. Refer to JEDEC
burrs. Mold flash protrusions or gate burrs shall not exceed 0.15
mm per end. Dimensions E1 does not include interlead flash or
protrusion. Interlead flasg or protrusion shall not exceed 0.15 mm
per side.
Dimensions D and E1 are deteremined at the outermost extremes
of the plastic body exclusive of mold flash, tie bar burrs, gate burrs,
and interlead flash, but including any mismatch between the top
and bottom of the plastic body.
mm and 0.15 mm from the lead tip.
dambar protrusion shall be 0.80 mm total in excess of the “b”
dimension at maximum material condition. The dambar cannot be
located on the lower radius of the foot. Minimum space between
protrusion and an adjacent lead shall not be less than 0.07 mm.
Drawing MO-193, Variation AB for additional information.
SEATING
PLANE
E1
1
5
Top View
Side View
b
e1
D
2
TITLE
5TS1, 5-lead, 1.60 mm Body, Plastic Thin
Shrink Small Outline Package (Shrink SOT)
e
3
4
A2
A1
E
A
SYMBOL
A
A1
A2
c
D
E
E1
L1
e
e1
b
COMMON DIMENSIONS
(Unit of Measure = mm)
0.00
0.70
0.08
0.30
MIN
End View
–
Atmel AT24C16C
C
GPC
2.90 BSC
2.80 BSC
1.60 BSC
0.95 BSC
1.90 BSC
0.60 REF
TSZ
NOM
0.90
–
–
–
–
C
L1
L
DRAWING NO.
MAX
1.10
0.10
1.00
0.20
0.50
5TS1
NOTE
1, 2
1, 2
1, 2
3, 4
3
11/05/08
REV.
B
21