AD8392ARE Analog Devices Inc, AD8392ARE Datasheet - Page 16

• Manufacturer Part Number: AD8392ARE
• Description: IC LINE DRVR ADSL/ADSL2 28TSSOP
• Manufacturer: Analog Devices Inc
• Type: Driverr

Specifications of AD8392ARE

• Number Of Drivers/receivers: 2/0
• Protocol: xDSL
• Voltage - Supply: 5 V ~ 24 V
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP Exposed Pad, 28-eTSSOP, 28-HTSSOP
• Power Supply Requirement: Single/Dual
• Package Type: TSSOP EP
• Slew Rate: 900V/us
• Pin Count: 28
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

AD8392
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD8392ARE
AD8392ARE-REEL
AD8392ARE-REEL7
AD8392AREZ
AD8392AREZ-REEL
AD8392AREZ-REEL7
AD8392ACP-R2
AD8392ACP-REEL
AD8392ACP-REEL7
1
©2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = Pb-free part.
Figure 42. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ], 5 mm × 5 mm Body, Very Thin Quad (CP-32-3)—Dimensions shown in millimeters
1
1
Figure 41. 28-Lead Thin Shrink Small Outline with Exposed Pad [TSSOP/EP], (RE-28-1), Dimensions shown in millimeters
1
MAX
1.20
INDICATOR
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
PIN 1
1.00
0.85
0.80
0.15
0.00
PIN 1
28
1
12° MAX
SEATING
PLANE
D04802–0–3/05(A)
BSC SQ
VIEW
TOP
0.30
0.19
5.00
BSC
0.65
9.80
9.70
9.60
COMPLIANT TO JEDEC STANDARDS MO-153AET
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.80 MAX
0.65 TYP
0.30
0.23
0.18
Package Description
28-Lead Thin Shrink Small Outline Package (TSSOP/EP)
28-Lead Thin Shrink Small Outline Package (TSSOP/EP)
28-Lead Thin Shrink Small Outline Package (TSSOP/EP)
28-Lead Thin Shrink Small Outline Package (TSSOP/EP)
28-Lead Thin Shrink Small Outline Package (TSSOP/EP)
28-Lead Thin Shrink Small Outline Package (TSSOP/EP)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
SEATING
PLANE
BSC SQ
15
14
4.75
0.20 REF
Rev. A | Page 16 of 16
1.05
1.00
0.80
4.50
4.40
4.30
0.05 MAX
0.02 NOM
0.60 MAX
6.40
BSC
COPLANARITY
0.20
0.09
BSC
0.50
0.40
0.30
0.50
0.08
8°
0°
24
17
16
25
(BOTTOM VIEW)
0.60 MAX
EXPOSED
PAD
BOTTOM VIEW
(Pins Down)
EXPOSED
BSC
3.50
PAD
0.75
0.60
0.45
32
9
1
8
3.50 REF
3.45
3.30 SQ
3.15
0.25 MIN
PIN 1
INDICATOR
BSC
3.00
Package Outline
RE-28-1
RE-28-1
RE-28-1
RE-28-1
RE-28-1
RE-28-1
CP-32-3
CP-32-3
CP-32-3