SI5100-F-BC Silicon Laboratories Inc, SI5100-F-BC Datasheet - Page 37

• Manufacturer Part Number: SI5100-F-BC
• Description: IC TXRX SERIAL/DESERIAL 195CBGA
• Manufacturer: Silicon Laboratories Inc
• Type: Transceiverr
• Series: SiPHY®r

Specifications of SI5100-F-BC

• Package / Case: 196-BGA
• Number Of Drivers/receivers: 1/1
• Protocol: SONET/SDH
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Product: RF / Wireless
• Supply Voltage (max): 1.89 V, 3.47 V
• Supply Voltage (min): 1.71 V
• Supply Current: 0.83 A
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 20 C
• Mounting Style: SMD/SMT
• Maximum Power Dissipation: 1600 mW
• Number Of Channels: 1
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
• Other names: 336-1135; SI5100-BC

20. 15x15 mm 195L PBGA Recommended PCB Layout
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1.
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components.
be 60 µm minimum, all the way around the pad.
paste release.
Symbol
C1
C2
E1
E2
X
0.40
Min
Rev. 1.4
13.00
13.00
Nom
0.45
1.00
1.00
Max
0.50
Si5100
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