SI5110-F-BC Silicon Laboratories Inc, SI5110-F-BC Datasheet - Page 34

• Manufacturer Part Number: SI5110-F-BC
• Description: IC TXRX SERIAL/DESERIAL 99CBGA
• Manufacturer: Silicon Laboratories Inc
• Type: Transceiverr
• Series: SiPHY®r

Specifications of SI5110-F-BC

• Package / Case: 99-CBGA
• Number Of Drivers/receivers: 1/1
• Protocol: SONET/SDH
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Product: Telecom
• Supply Voltage (max): 1.89 V, 3.47 V
• Supply Voltage (min): 1.71 V
• Supply Current: 0.7 A
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 20 C
• Mounting Style: SMD/SMT
• Maximum Power Dissipation: 1300 mW
• Number Of Channels: 1
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
• Other names: 336-1137; SI5110-BC

S i 5 11 0
20. 11x11 mm 99L CBGA Recommended PCB Layout
34
Notes:
Symbol
1. The Placement Courtyard is the minimum keep-out area required to assure assembly clearances.
2. Pad Diameter is Copper Defined (Non-Solder Mask Defined/NSMD).
3. OSP Surface Finish Recommended.
4. Controlling dimension is millimeters.
5. Land Pad Dimensions comply with IPC-SM-782 guidelines.
6. Target solder paste volume per pad is 0.065 mm3 ± 0.010 mm3 (4000 mils3 ± 600 mils3).
7. Recommended stencil type is chemically etched stainless steel with circularly tapered apertures.
C
D
E
F
X
Recommended stencil aperture dimensions to achieve target solder paste volume are 0.191mm
thick x 0.68±0.01 mm diameter, with a 0.025 mm taper.
Placement Courtyard
Placement Courtyard
Column Width
Pad Diameter
Row Height
Parameter
Pad Pitch
12.00
0.64
Min
—
—
—
Rev. 1.3
Dimension
9.00 REF
9.00 REF
1.00 BSC
Nom
0.68
—
Max
0.72
—
—
—
—
Notes
2, 3
1