293D477X96R3E2T Vishay, 293D477X96R3E2T Datasheet - Page 12
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293D477X96R3E2T
Manufacturer Part Number
293D477X96R3E2T
Description
Tantalum Capacitors - Solid SMD 470uF 6.3volts 10% E case
Manufacturer
Vishay
Series
293Dr
Datasheet
1.293D337X06R3E2T.pdf
(13 pages)
Specifications of 293D477X96R3E2T
Capacitance
470 uF
Voltage Rating
6.3 Volts
Esr
0.5 Ohms
Tolerance
10 %
Operating Temperature Range
- 55 C to + 85 C
Package / Case
7343-43 metric
Dimensions
4.3 mm W x 7.3 mm L
Height
4 mm
Mfr Case Code
E Case
Product
Tantalum Solid Low ESR Commercial Grade
Lead Spacing
1.3 mm
Termination Style
SMD/SMT
Lead Free Status / Rohs Status
No RoHS Version Available
GUIDE TO APPLICATION
10.
Document Number: 40002
Revision: 25-Apr-05
SOLDERING PROFILE
RECOMMENDED MOUNTING PAD GEOMETRIES in inches [millimeters]
Code
Case
A
B
C
D
E
P
25 ˚C
Recommended Mounting Pad Geometries: Proper mounting pad geometries are essential for successful solder
connections. These dimensions are highly process sensitive and should be designed to minimize component rework due
to unacceptable solder joints. The dimensional configurations shown are the recommended pad geometries for both wave
and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board designers and may
be fine tuned if necessary based upon the peculiarities of the soldering process and/or circuit board design.
Recommended SnPb Reflow Soldering Profile
100 ˚C
(Min.)
0.034
[0.87]
0.061
[1.54]
0.061
[1.54]
0.066
[1.68]
0.066
[1.68]
0.034
[0.87]
240 ˚C
150 ˚C
B
A
TIME (seconds)
Wave Solder Pads
183 ˚C
(Nom.)
60 - 90 sec
Pad Dimensions
0.085
[2.15]
0.085
[2.15]
0.106
[2.70]
0.106
[2.70]
0.106
[2.70]
0.085
[2.15]
Preheat
B
All Case Codes
C
D
(Nom.)
(Continued)
0.053
[1.35]
0.065
[1.65]
0.124
[3.15]
0.175
[4.45]
0.175
[4.45]
0.053
[1.35]
TANTAMOUNT®, Commercial, Surface Mount
C
For technical questions, contact: tantalum@vishay.com
10 sec
60 sec
Solid Tantalum Chip Capacitors
(Nom.)
0.222
[5.65]
0.234
[5.95]
0.337
[8.55]
0.388
[9.85]
0.388
[9.85]
0.222
[5.65]
E
D
A
(Nom.)
0.048
[1.23]
0.048
[1.23]
0.050
[1.28]
0.050
[1.28]
0.050
[1.28]
0.048
[1.23]
E
Code
Case
25 ˚C
A
B
C
D
E
P
Recommended Pb Free Reflow Soldering Profile
150 ˚C
260 ˚C
200 ˚C
(Min.)
0.071
[1.80]
0.110
[2.80]
0.110
[2.80]
0.118
[3.00]
0.118
[3.00]
0.071
[1.80]
A
B
TIME (seconds)
217 ˚C
Reflow Solder Pads
60 - 150 sec
(Nom.)
Pad Dimensions
0.085
[2.15]
0.085
[2.15]
0.106
[2.70]
0.106
[2.70]
0.106
[2.70]
0.085
[2.15]
Preheat
B
All Case Codes
D
C
(Nom.)
0.053
[1.35]
0.065
[1.65]
0.124
[3.15]
0.175
[4.45]
0.175
[4.45]
0.053
[1.35]
C
Vishay Sprague
10 sec
60 sec
(Nom.)
0.222
[5.65]
0.234
[5.95]
0.337
[8.55]
0.388
[9.85]
0.388
[9.85]
0.222
[5.65]
D
E
www.vishay.com
A
293D
(Nom.)
0.048
[1.23]
0.048
[1.23]
0.050
[1.28]
0.050
[1.28]
0.050
[1.28]
0.048
[1.23]
E
12