MCP23S09-E/P Microchip Technology, MCP23S09-E/P Datasheet - Page 47

• Manufacturer Part Number: MCP23S09-E/P
• Description: IC I/O EXPANDER SPI 8B 18DIP
• Manufacturer: Microchip Technology

Specifications of MCP23S09-E/P

• Interface: SPI
• Number Of I /o: 8
• Interrupt Output: Yes
• Frequency - Clock: 10MHz
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 18-DIP (0.300", 7.62mm)
• Chip Configuration: 8 Bit
• Bus Frequency: 10MHz
• Ic Interface Type: SPI
• No. Of I/o's: 8
• Supply Voltage Range: 1.8V To 5.5V
• Digital Ic Case Style: DIP
• No. Of Pins: 18
• Termination Type: DIP
• Filter Terminals: DIP
• Rohs Compliant: Yes
• Features: Open-drain Outputs
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2009 Microchip Technology Inc.
PART NO.
Device
Temperature
Range
Package
Device
Temperature
‚
Range
MCP23009T:
MCP23S09:
MCP23S09T:
E
MG = Plastic Quad Flat, No Lead Package
P
SO
SS
MCP23009:
X
= -40°C to +125°C (Extended) *
= Plastic DIP (300 mil Body), 18-Lead
= Plastic SOIC (300 mil Body), 18-Lead
= Plastic SSOP (5.3 mm), 20-Lead
(3x3x0.9 mm Body), 16-Lead
Package
/XX
8-Bit I/O Expander w/ I
8-Bit I/O Expander w/ I
(Tape and Reel)
8-Bit I/O Expander w/ SPI Interface
8-Bit I/O Expander w/ SPI Interface
(Tape and Reel)
2
2
C™ Interface
C Interface
MCP23009/MCP23S09
Examples:
a)
b)
c)
d)
e)
f)
a)
b)
c)
d)
MCP23009-E/P:
MCP23009-E/SO: Extended Temp.,
MCP23009T-E/SO: Tape and Reel,
MCP23009-E/SS:
MCP23009T-E/SS: Tape and Reel,
MCP23009-E/MG: Extended Temp.,
MCP23S09-E/P:
MCP23S09-E/SO: Extended Temp.,
MCP23S09T-E/SO: Tape and Reel,
MCP23S09T-E/MG: Tape and Reel,
.
Extended Temp.,
18LD PDIP package.
18LD SOIC package.
Extended Temp.,
18LD SOIC package.
Extended Temp.,
20LD SSOP package.
Extended Temp.,
20LD SSOP package.
16LD QFN package.
Extended Temp.,
18LD PDIP package.
18LD SOIC package.
Extended Temp.,
18LD SOIC package.
Extended Temp.,
16LD QFN package.
DS22121B-page 47