MCP23017-E/ML Microchip Technology, MCP23017-E/ML Datasheet - Page 38
![IC I/O EXPANDER I2C 16B 28QFN](/photos/6/81/68120/150-28-qfn_sml.jpg)
MCP23017-E/ML
Manufacturer Part Number
MCP23017-E/ML
Description
IC I/O EXPANDER I2C 16B 28QFN
Manufacturer
Microchip Technology
Datasheet
1.MCP23S17-ESP.pdf
(48 pages)
Specifications of MCP23017-E/ML
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Interface
I²C
Number Of I /o
16
Interrupt Output
Yes
Frequency - Clock
1.7MHz
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Logic Family
MCP23017
Propagation Delay Time
50 ns
Operating Supply Voltage
1.8 V to 5.5 V
Power Dissipation
700 mW
Operating Temperature Range
- 40 C to + 125 C
Input Voltage
1.8 V to 5.5 V
Logic Type
I/O Expander
Maximum Clock Frequency
10 MHz
Maximum Operating Frequency
1.7 MHz
Mounting Style
SMD/SMT
Output Current
25 mA
Output Voltage
1.8 V to 4.5 V
Package
28QFN EP
Chip Configuration
16 Bit
Bus Frequency
1.7MHz
Ic Interface Type
I2C
No. Of I/o's
16
Supply Voltage Range
1.8V To 5.5V
Digital Ic Case Style
QFN
No. Of Pins
28
Interface Type
I2C
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCP23X17EV - BOARD EVAL FOR MCP23X17GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP23017-E/ML
Manufacturer:
TI
Quantity:
12 580
Part Number:
MCP23017-E/ML
Manufacturer:
MIC
Quantity:
20 000
MCP23017/MCP23S17
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS21952B-page 38
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
Dimension Limits
Units
A2
A1
E1
eB
b1
N
A
E
D
e
L
c
b
e
1.345
.120
.015
.290
.240
.110
.008
.040
.014
A2
MIN
E1
–
–
L
.100 BSC
INCHES
1.365
NOM
.310
.285
.130
.010
.050
.018
.135
28
–
–
–
Microchip Technology Drawing C04-070B
© 2007 Microchip Technology Inc.
eB
E
1.400
MAX
.200
.150
.335
.295
.150
.015
.070
.022
.430
–
c