SI3019-F-FM Silicon Laboratories Inc, SI3019-F-FM Datasheet - Page 120

• Manufacturer Part Number: SI3019-F-FM
• Description: IC VOICE DAA GCI/PCM/SPI 20-QFN
• Manufacturer: Silicon Laboratories Inc
• Series: -r

Specifications of SI3019-F-FM

• Function: Data Access Arrangement (DAA)
• Interface: GCI, PCM, SPI
• Number Of Circuits: 1
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Supply: 8.5mA
• Power (watts): *
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 20-VFQFN Exposed Pad
• Includes: *
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Si3050 + Si3011/18/19
14.1. PCB Land Pattern: Si3011/18/19 TSSOP
120
Table 35. 16-Pin Thin Shrink Small Outline Package (TSSOP) PCB Land Patten Dimensions
Figure 61. 16-Pin Thin Shrink Small Outline Package (TSSOP) PCB Land Pattern
Dimension
Notes:
1. This Land Pattern Design is based on IPC-7351
2. All feature sizes shown are at Maximum Material Condition
C1
X1
Y1
specifications for Density Level B (Median Land Protrusion).
(MMC) and a card fabrication tolerance of 0.05 mm is
assumed.
E
Pad Column Spacing
Pad Row Pitch
Pad Width
Pad Length
Feature
Rev. 1.4
(mm)
5.80
0.65
0.45
1.40