CP2102-GM Silicon Laboratories Inc, CP2102-GM Datasheet - Page 10

• Manufacturer Part Number: CP2102-GM
• Description: IC USB-TO-UART BRIDGE 28VQFN
• Manufacturer: Silicon Laboratories Inc

Specifications of CP2102-GM

• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Applications: USB
• Interface: UART
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 3.6 V
• Supply Current (max): 100 mA
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Package Type: QFN
• Rad Hardened: No
• Usb Version: 2.0
• Data Rate: 1Mbps
• Supply Voltage Range: 1.8V To 3.6V, 3V To 3.6V
• Operating Temperature Range: -40°C To +85°C
• Digital Ic Case Style: MLP
• No. Of Pins: 28
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 336-1161 - KIT EVALUATION FOR CP2102
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1160; CP2102

CP2102
10
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
6. The stencil thickness should be 0.125 mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
8. A 3x3 array of 0.90 mm openings on a 1.1 mm pitch should be used for the center pad to
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small
C1
C2
X1
E
mask and the metal pad is to be 60 µm minimum, all the way around the pad.
to assure good solder paste release.
assure the proper paste volume (67% Paste Coverage).
Body Components.
Table 7. QFN-28 PCB Land Pattern Dimensions
Figure 4. QFN-28 Recommended PCB Land Pattern
0.20
Min
4.80
4.80
0.50
0.30
Max
Rev. 1.4
Dimension
X2
Y1
Y2
3.20
0.85
3.20
Min
Max
3.30
0.95
3.30