MAX1840EUB Maxim Integrated Products, MAX1840EUB Datasheet - Page 6
![IC XLATR SIM/SMART-CARD 10-UMAX](/photos/6/57/65724/175-10-umax_sml.jpg)
MAX1840EUB
Manufacturer Part Number
MAX1840EUB
Description
IC XLATR SIM/SMART-CARD 10-UMAX
Manufacturer
Maxim Integrated Products
Datasheet
1.MAX1840EUB.pdf
(8 pages)
Specifications of MAX1840EUB
Applications
Smart Card
Interface
MICROWIRE™, QSPI™, Serial, SPI™
Voltage - Supply
1.4 V ~ 5.5 V, 1.7 V ~ 5.5 V
Package / Case
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type
Surface Mount
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
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The MAX1840/MAX1841 provide the necessary level
translation for interfacing with SIMs and smart cards in
multivoltage systems. These devices operate with logic
supply voltages between +1.4V and +5.5V on the con-
troller side (DV
card side (V
is 1µA while operating in an idle state (see Electrical
Characteristics). Figure 1 shows the MAX1840/MAX1841
test circuit. The Typical Application Circuit appears at the
end of this data sheet.
The MAX1840/MAX1841 provide level translators for a
clock input, a reset input, and a bidirectional data IO.
The clock and reset inputs (CIN and RIN) are level shift-
ed from the controller-side supply rails (DV
to the card-side supply rails (V
nected to an open-drain controller output, DATA and IO
provide bidirectional level translation. All level transla-
tion is valid for DV
MAX1840/MAX1841 contain internal pull up resistors
from DATA to the controller-side supply (DV
from IO to the card-side supply (V
controller outputs, see the Data Driver section for bidi-
rectional data translation.
When using a microcontroller (µC) without an open-drain
output, use the data driver (DDRV) input to send data to
the SIM/smart card, while DATA provides the controller-
side output for bidirectional data transfer. When not
used, connect DDRV to DV
rent.
For the MAX1840, drive SHDN low to activate shut-
down. Connect SHDN to DV
operation. To allow for card insertion and removal, shut-
down mode actively pulls CLK, RST, and IO low; it also
disconnects the internal 10kΩ pull up resistor from V
to prevent excessive current draw. Shutdown mode
reduces the total supply current (I
0.01µA.
The SIM/smart card specifications require that the card-
side pins (V
prior to inserting the SIM/smart card. For applications
using the MAX1686H (Figure 3), the easiest way to
achieve this is by shutting down the MAX1686H or by
Low-Voltage SIM/Smart Card
Level Translators in µMAX
6
_______________________________________________________________________________________
SIM/Smart Card Insertion/Removal
CC
CC
CC
). The total supply current (I
, CLK, RST, IO) be at ground potential
) and between +1.7V and +5.5V on the
Data Driver (MAX1841 Only)
CC
Detailed Description
≥ V
CC
CC
CC
to reduce total supply cur-
CC
or drive high for normal
or DV
Level Translation
to GND). When con-
Shutdown Mode
CC
DVCC
CC
). For push-pull
DVCC
≤ V
CC
+ I
CC
CC
to GND)
VCC
+ I
. The
) and
VCC
) to
CC
)
driving SHDN (MAX1840 only) low. If specific sequenc-
ing is desired, pull IO low by driving either DATA or
DDRV (MAX1841 only) low, and pull CLK and RST low
by driving CIN and RIN low, respectively.
As with all Maxim devices, ESD-protection structures on
all pins protect against ESDs encountered during han-
dling and assembly. For further protection during card
insertion and removal, the pins that connect to the card
socket (CLK, RST, IO, V
tion against ±10kV of ESD. The ESD structures with-
stand high ESD in all states: normal operation,
shutdown, and power-down. After an ESD event, the
MAX1840/MAX1841 continue working without latchup.
A 1µF bypass capacitor from V
exceed ±10kV ESD specifications.
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report documenting test
setup, test methodology, and test results.
To provide 5V when interfacing with a 5V SIM/smart card,
+3V systems require a DC-DC converter. The MAX1686H
+5V regulating charge pump for SIM cards provides
Figure 1. MAX1840/MAX1841 Test Circuit
+1.8V
NOTE: ALL CAPACITANCES INCLUDE CAPACITIVE LOADS OF
TEST PROBES AND BOARD LAYOUT.
30pF
*
SHDN FOR MAX1840 ONLY;
DDRV FOR MAX1841 ONLY.
Applications Information
DV
RIN
CIN
DDRV*
DATA
SHDN*
CC
MAX1840
MAX1841
SIM/Smart Card Interface
CC
, and GND) provide protec-
CLK
GND
RST
V
CC
IO
ESD Test Conditions
CC
to GND is required to
ESD Protection
30pF
30pF 30pF
+1.8V,
+3.0V, OR
+5.0V