AD53509JSQ Analog Devices Inc, AD53509JSQ Datasheet - Page 8
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AD53509JSQ
Manufacturer Part Number
AD53509JSQ
Description
IC DVR/COMP W/HEATSINK 52-LQFP
Manufacturer
Analog Devices Inc
Datasheet
1.AD53509JSQ.pdf
(12 pages)
Specifications of AD53509JSQ
Rohs Status
RoHS non-compliant
Applications
Testing Equipment
Package / Case
52-LQFP
Mounting Type
Surface Mount
Voltage - Supply
-
Interface
-
AD53509
ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter
Power Supply Voltage
Inputs
Outputs
Environmental
1
2
Output short-circuit protection is guaranteed as long as proper heat sinking
is employed to ensure compliance with the operating temperature limits.
To ensure lead coplanarity (±0.002 inches) and solderability, handling with
bare hands should be avoided and the device should be stored in
environments at 24°C ± 5°C (75°F ± 10°F) with relative humidity not to
exceed 65%.
HCOMP, LCOMP to V
V to GND
V to GND
V to V
VCCO to GND
PWRGND, HQGND, HQGND2
DATA, DATA, IOD, IOD, RLD, RLD
DATA to DATA, IOD to IOD, RLD to RLD
LEL, LEL, LEH, LEH
LEL to LEL, LEH to LEH
INHL, INHL
INHL to INHL
V
V
(V − V
IOHC
IOLC
HCOMP
LCOMP
V
V
VHDCPL
VLDCPL
QH, QH, QL, QL Maximum I
THERM
IOHRTN, IOLRTN
VCOMS Short-Circuit Duration
Operating Temperature (Junction)
Storage Temperature Range
Lead Temperature (Soldering, 10 sec)
CC
EE
CC
H
H
OUT
OUT
H
, V
Continuous
Surge
to V
L
Short-Circuit Duration
Inhibit Mode
, V , VCOMI to GND
L
T
EE
T
) and (V
T
− V
OUT
L
)
OUT
2
±0.4 V
±10 V
100 mA
0 V to 13 V
−3.5 V to +8.5 V
3 sec
175°C
Rating
13 V
−8 V
20 V
10 V
−2 V to +5 V
±3 V
−2 V to +5 V
±3 V
−2 V to +5 V
±3 V
−3 V to +8 V
±10 V
±6 V
±6 V
−3 V to +8 V
−3 V to +8 V
±10 V
Indefinite
−3 V to +8 V
Do not connect except
for capacitor to V
Do not connect except
for capacitor to V
50 mA
−65°C to +150°C
260°C
1
1
CC
EE
Rev. B | Page 8 of 12
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 9. Package Thermal Resistance
Airflow (m/s)
0
1
2
For liquid-cooled applications, θ = 3.0°C/W.
ESD CAUTION
JC
θ
42.7
37.8
36.4
JA
(°C/W)