EPC9003 EPC, EPC9003 Datasheet - Page 5

BOARD DEV FOR EPC2010 200V GAN

EPC9003

Manufacturer Part Number
EPC9003
Description
BOARD DEV FOR EPC2010 200V GAN
Manufacturer
EPC
Series
-r
Datasheet

Specifications of EPC9003

Design Resources
EPC9003 Gerber Files EPC9003 Bill of Materials
Featured Product
EPC Development Tools
Main Purpose
Power Management, Half H-Bridge Driver (External FET)
Embedded
No
Utilized Ic / Part
EPC2010
Primary Attributes
200V, 5A Max Output GaNFET Capability
Secondary Attributes
GaNFET Driver Circuit Uses 7 ~ 12V
Lead Free Status / Rohs Status
Contains lead / RoHS non-compliant
Other names
917-1012
eGaN® FET DATASHEET
EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2011 |
RECOMMENDED
LAND PATTERN
(units in µm)
DIE OUTLINE
Solder Bar View
Side View
e
2
f
1
g
1
2
600
3
250
3
4
A
4
X5
f
5
3554
250
X5
X4
g
5
6
SEATING PLANE
600
X4
6
7
7
DIM
B
A
d
e
g
c
f
Pad no. 1 is Gate;
Pads no. 3, 5, 7 are Drain;
Pads no. 4, 6 are Source;
Pad no. 2 is Substrate
3524
1602
1379
MIN
577
262
245
600
MICROMETERS
Nominal
3554
1632
1382
580
277
250
600
change without notice.
Information subject to
Revised May, 2011
EPC2010
| PAGE 5
MAX
3584
1662
1385
583
292
255
600

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