ADG1636BRUZ Analog Devices Inc, ADG1636BRUZ Datasheet - Page 16

• Manufacturer Part Number: ADG1636BRUZ
• Description: IC SWITCH DUAL SPDT 16TSSOP
• Manufacturer: Analog Devices Inc
• Type: Analog Switchr

Specifications of ADG1636BRUZ

• Design Resources: Precision Pulse Oximeter LED Current Sinks Using ADA4505-2, ADR1581, and ADG1636 (CN0125)
• Function: Switch
• Circuit: 2 x SPDT
• On-state Resistance: 1.2 Ohm
• Voltage Supply Source: Single, Dual Supply
• Voltage - Supply, Single/dual (±): 3.3 V ~ 16 V, ±3.3 V ~ 8 V
• Current - Supply: 1µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Analog Switch Type: SPDT
• No. Of Channels: 2
• Bandwidth: 25MHz
• On State Resistance Max: 1ohm
• Turn Off Time: 182ns
• Turn On Time: 119ns
• Supply Voltage Range: 3.3V To 16V
• Package: 16TSSOP
• Maximum On Resistance: 3.6@3.3V Ohm
• Maximum Propagation Delay Bus To Bus: 209@±5V|153@12V|271@5V|449@3.3V ns
• Maximum Turn-off Time: 454@3.3V ns
• Maximum Turn-on Time: 306@3.3V ns
• Switch Architecture: SPDT
• Power Supply Type: Single|Dual
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADG1636
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG1636BRUZ
ADG1636BRUZ-REEL
ADG1636BRUZ-REEL7
ADG1636BCPZ- REEL
ADG1636BCPZ-REEL7
1
©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
1
1
1
1
1
INDICATOR
SEATING
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
PLANE
1.00
0.85
0.80
PIN 1
12° MAX
0.15
0.05
D07983-0-9/09(A)
4.50
4.40
4.30
PIN 1
TOP VIEW
Figure 34. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Figure 33. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC SQ
BSC
0.30
0.23
0.18
0.65
4.00
16
1
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC.
4 mm × 4 mm Body, Very Thin Quad (CP-16-13)
COMPLIANT TO JEDEC STANDARDS MO-153-AB
5.10
5.00
4.90
0.10
Dimensions shown in millimeters
Dimensions shown in millimeters
BSC SQ
0.20 REF
0.30
0.19
3.75
Package Description
16- Lead Thin Shrink Small Outline Package [TSSOP]
16- Lead Thin Shrink Small Outline Package [TSSOP]
16- Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
9
8
Rev. A | Page 16 of 16
1.20
MAX
SEATING
PLANE
6.40
BSC
BSC
0.65
(RU-16)
COPLANARITY
1.95 BCS
0.20
0.09
0.60 MAX
0.08
12
9
BOT TOM VIEW
13
8
EXPOSED
PAD
8°
0°
16
5
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
4
0.50
0.40
0.30
1
2.65
2.50 SQ
2.35
0.25 MIN
0.75
0.60
0.45
Package Option
RU-16
RU-16
RU-16
CP-16-13
CP-16-13