ADG508AKRZ Analog Devices Inc, ADG508AKRZ Datasheet - Page 16

• Manufacturer Part Number: ADG508AKRZ
• Description: IC MULTIPLEXER 8X1 16SOIC
• Manufacturer: Analog Devices Inc

Specifications of ADG508AKRZ

• Function: Multiplexer
• Circuit: 1 x 8:1
• On-state Resistance: 300 Ohm
• Voltage Supply Source: Dual Supply
• Voltage - Supply, Single/dual (±): ±10.8 V ~ 16.5 V
• Current - Supply: 20µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• No. Of Circuits: 1
• Supply Current: 600µA
• On State Resistance Max: 280ohm
• Supply Voltage Range: 10.8V To 16.5V
• Operating Temperature Range: -40°C To +85°C
• Analog Switch Case Style: SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

ADG508A/ADG509A
ORDERING GUIDE
Model
ADG508AKN
ADG508AKNZ
ADG508AKR
ADG508AKR-REEL
ADG508AKR-REEL7
ADG508AKRZ
ADG508AKRZ-REEL
ADG508AKRZ-REEL7
ADG508AKP
ADG508AKP-REEL
ADG508AKPZ
ADG508AKPZ-REEL
ADG508ABQ
ADG508ATQ
ADG508ATE
ADG508ABCHIPS
ADG508ATCHIPS
ADG509AKN
ADG509AKNZ
ADG509AKR
ADG509AKR-REEL
ADG509AKR-REEL7
ADG509AKRZ-REEL
ADG509AKRZ-REEL7
ADG509AKP
ADG509AKP-REEL
ADG509AKPZ
ADG509AKPZ-REEL
ADG509ABQ
ADG509ATQ
ADG509ATQ/883B
ADG509ABCHIPS
ADG509ATCHIPS
1
©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
1
1
1
1
1
1
1
1
1
1
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−55°C to +125°C
−55°C to +125°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−55°C to +125°C
−55°C to +125°C
D00051-0-7/09(D)
Package Description
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
20-Lead Plastic Leaded Chip Carrier [PLCC]
20-Lead Plastic Leaded Chip Carrier [PLCC]
20-Lead Plastic Leaded Chip Carrier [PLCC]
20-Lead Plastic Leaded Chip Carrier [PLCC]
16-Lead Ceramic Dual In-Line Package [CERDIP]
16-Lead Ceramic Dual In-Line Package [CERDIP]
20-Terminal Ceramic Leadless Chip Carrier [LCC]
DIE
DIE
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
20-Lead Plastic Leaded Chip Carrier [PLCC]
20-Lead Plastic Leaded Chip Carrier [PLCC]
20-Lead Plastic Leaded Chip Carrier [PLCC]
20-Lead Plastic Leaded Chip Carrier [PLCC]
16-Lead Ceramic Dual In-Line Package [CERDIP]
16-Lead Ceramic Dual In-Line Package [CERDIP]
16-Lead Ceramic Dual In-Line Package [CERDIP]
DIE
DIE
Rev. D | Page 16 of 16
Package Option
N-16
N-16
R-16
R-16
R-16
R-16
R-16
R-16
P-20
P-20
P-20
P-20
Q-16
Q-16
E-20-1
N-16
N-16
R-16
R-16
R-16
R-16
R-16
P-20
P-20
P-20
P-20
Q-16
Q-16
Q-16