S29GL256S10TFI010 Spansion Inc., S29GL256S10TFI010 Datasheet - Page 94

• Manufacturer Part Number: S29GL256S10TFI010
• Description: Flash 256 MBIT 3V 100NS PAGE MODE FLASH
• Manufacturer: Spansion Inc.

Specifications of S29GL256S10TFI010

• Data Bus Width: 16 bit
• Memory Type: Flash
• Memory Size: 256 Mbit
• Architecture: Uniform
• Timing Type: Asynchronous
• Interface Type: CFI
• Access Time: 100 ns
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.7 V
• Maximum Operating Current: 100 mA
• Operating Temperature: - 40 C to + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TSOP-56
• Lead Free Status / Rohs Status: Compliant

94
Valid Combinations
The Recommended Combinations table lists configurations planned to be available in volume. The table
below will be updated as new combinations are released. Consult your local sales representative to confirm
availability of specific combinations and to check on newly released combinations.
Notes:
1. Package Type 0 is standard option.
2. Additional speed, package, and temperature options maybe offered in the future. Check with your local sales representative for
availability.
S29GL01GS
S29GL512S
S29GL256S
S29GL128S
Base OPN
Speed (ns)
100, 110
110, 120
100, 110
110, 120
100, 110
100, 110
90, 100
90, 100
110
110
100
100
D a t a
Package and
Temperature
WEI
WEI
WEI
WEI
DHI
DHI
DHI
DHI
TFI
TFI
TFI
TFI
TFI
TFI
TFI
TFI
S h e e t
GL-S MirrorBit
S29GL-S Valid Combinations
Model Number
( A d v a n c e
V1, V2
V1, V2
V1, V2
V1, V2
01, 02
01, 02
01, 02
01, 02
01, 02
01, 02
01, 02
01, 02
®
Family
Packing Type
I n f o r m a t i o n )
S29GL_128S_01GS_00_01 February 11, 2011
0, 3
0, 3
0, 3
0, 3
0, 3
0, 3
0, 3
0, 3
9
9
9
9
56-pin TSOP
64-ball FBGA 9 mm x 9 mm
725 µm thickness without polyimide
56-pin TSOP
56-pin TSOP
64-ball FBGA 9 mm x 9 mm
725 µm thickness without polyimide
56-pin TSOP
56-pin TSOP
64-ball FBGA 9 mm x 9 mm
725 µm thickness without polyimide
56-pin TSOP
56-pin TSOP
64-ball FBGA 9 mm x 9 mm
725 µm thickness without polyimide
56-pin TSOP
Package Description