PA.22A Taoglas Limited, PA.22A Datasheet
PA.22A
Specifications of PA.22A
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Related parts for PA.22A
PA.22A Summary of contents
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... Part No. Product Name Description SPE-11-8-060/D SPECIFICATION : PA.22A : GSM Dielectric PIFA Antenna (DPA™) : Tri-band - 880~960 MHz, 1710~1990 MHz, 0dB Gain Size: 29.8mm*6mm*5mm 29-July-11 Page ...
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Scope This specification is for a Tri-band GSM miniature PIFA (Dielectric Planar inverted-F Type Antenna) Antenna for internal SMT mounting. (DPA™) Note: The antenna also shows a response at 850MHz which means the antenna can also be defined on ...
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S11 Response Curve 2.1 SPE-11-8-060/D 29-July-11 Page ...
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Radiation patterns also available (measured in free space and on evaluation board) 2.2 Gain and Efficiency SPE-11-8-060/D 29-July-11 Page ...
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SPE-11-8-060/D 29-July-11 Page ...
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SPE-11-8-060/D 29-July-11 Page ...
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SPE-11-8-060/D 29-July-11 Page ...
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SPE-11-8-060/D 29-July-11 Page ...
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SPE-11-8-060/D 29-July-11 Page ...
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SPE-11-8-060/D 29-July-11 Page ...
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SPE-11-8-060/D 29-July-11 Page ...
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SPE-11-8-060/D 29-July-11 Page ...
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SPE-11-8-060/D 29-July-11 Page ...
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Mechanical Dimensions 3.1 PA.22 Antenna SPE-11-8-060/D feed to module solder pads (mechanical only) 29-July-11 to ground Page ...
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Evaluation board dimensions 3.3 Recommended layout (as per Taoglas evalution board) Non metal area 6mm clearance ideally (minimum 4mm clearance) SPE-11-8-060/D 4.7nH inductor For EVB only feed to module 29-July-11 to ground Page ...
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View from underneath board – note solder pads either side – laid out on non metal area Layout dimensions - Allow 6mm clearance all around if possible (minimum 4mm) SPE-11-8-060/D 29-July-11 Page ...
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Recommended Transmission Line and Matching Network 3.4 Note: The PA.22 can be made “quad band” with appropriate matching circuit Guidelines for routing RF when designing a PCB; 1) Good 2) Bad SPE-11-8-060/D 29-July-11 Page ...
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Delivery Mode Blister tape to IEC 286-3, polyester Pieces per tape: 450 4 Reels (1800) in each Carton – Carton size 37cm*36cm*27.5cm Carton Weight – Net Weight 5.9kg – Gross Weight 7.5kg (approx) Note: Design application note also available ...
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Recommended Reflow Temperature Profile (1) Time shown in the above figures is measured from the point when chip surface reaches temperature. (2) Temperature difference in high temperature part should be within 110°C. (3) After soldering, do not force cool, ...