R46KF222000N0K Kemet, R46KF222000N0K Datasheet - Page 6

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R46KF222000N0K

Manufacturer Part Number
R46KF222000N0K
Description
CAP 0.022UF 275V EMI SUPPRESSION
Manufacturer
Kemet
Datasheet

Specifications of R46KF222000N0K

Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
399-5987
46KF222000N0K
*See size table.
All dimensions are in mm.
GeneRAl TeCHniCAl dATA
dielectric: polypropylene film.
Plates: metal layer deposited by evaporation under vacuum.
Winding: non-inductive type.
leads: tinned wire.
Protection: plastic case, thermosetting resin filled.
Box material is solvent resistant and flame retardant according to
UL94 V0.
marking: Manufacturer’s logo, series, capacitance, tolerance,
rated voltage, capacitor class, dielectric code, climatic category,
passive flammability category, manufacturing date code, approvals,
manufacturing plant.
Climatic category: 40/110/56 IEC 60068-1
operating temperature range: -40 to +110°C
Related documents:
eleCTRiCAl CHARACTeRiSTiCS
Rated voltage (V
Capacitance range:
Capacitance values: E6 series (IEC 60063 Norm).
Capacitance tolerances (measured at 1 kHz):
dissipation factor (dF):
insulation resistance:
Test voltage between terminations (on all pieces):
Ø d ±0.05
Test conditions
Temperature:
Voltage charge time:
Voltage charge:
Performance
* Typical value
1x10
30000 s (150000 s
±
tolerance
tg
* Typical value
1500Vac for 1 s + 2200Vdc for 1 s at +25°C
10% (K);
δ
5
10
M
Loose
-4
(5x10
at +25°C
±
R
±
0.6 or 0.8*
5% (J) available upon request
):
20% (M).
p ≤15
5
M
)
*
±
)
5°C:
*
IEC 60384-14, EN 60384-14.
275Vac (50/60Hz) / 560 Vdc
0.022
+25°C
1 min
100 Vdc
15 (8)* at 1kHz
22.5 ≤ p ≤ 27.5
for C
for C
µ
F to 10
±
Fig.1
0.8
5°C
>
0.33
0.33
µ
Taped
F
µ
µ
F
F
Fig.2
p = 37.5
±
5°C
1.0
155
meTAllized PolYPRoPYlene Film CAPACiToR
SELF-HEALING PRoPERTIES
Typical applications: This special R46 release is designed
for applications in series with the main
PRoDUCT CoDE: R46
Not for use in series with the mains.
See www.kemet.com for more information.
TeST meTHod And PeRFoRmAnCe
damp heat, steady state:
endurance:
Resistance to soldering heat:
(mm)
Pitch Box thickness (B)
10.0
15.0
15.0
22.5
27.5
37.5
Test conditions 1st
Temperature:
Relative humidity (RH):
Test duration:
Test conditions 2nd
Temperature:
Relative humidity (RH):
Test duration:
Test conditions 3rd
Temperature:
Relative humidity (RH):
Test duration:
Voltage value:
Performance
Dielectric strength:
Capacitance change |
Insulation resistance:
Test conditions
Temperature:
Test duration:
Voltage applied:
Performance
Dielectric strength:
Capacitance change |
Insulation resistance:
Test conditions
Solder bath temperature: +260°C
Dipping time (with heat screen):10 s
Performance
Capacitance change |
X2 CLASS (IEC 60384-14) - MKP Series
(mm)
<7.5
≥7.5
All
All
All
All
C/C|:
C/C|:
C/C|:
B max
B +0.2
B +0.2
B +0.2
B +0.2
B +0.2
B +0.3
no dielectric breakdown or
flashover at 4.3 x V
+40°C
+60°C
+40°C
no dielectric breakdown or
flashover at 4.3 x V
56 days
500 hours
500 hours
230 Vac, 50 Hz
R.46 S
93%
95%
93%
Maximum dimensions (mm)
+110°C
1000 h
1.25 x V
5%
50% of initial limit.
10%
50% of initial limit.
2%
±
±
±
2%
2%
2%
±
±
±
2°C
2°C
2°C
±
R
±
H max
H +0.1
H +0.1
H +0.1
H +0.1
H +0.1
H +0.1
±
2°C
+1000Vac 0.1 s/h
5°C
1 s
.
R
R
(d.c.)/1 min
(d.c.)/1 min
L +0.2
L +0.3
L +0.5
L +0.3
L +0.3
L +0.3
L max
09/2008
VeRSion

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