LX1992-02W EVAL KIT MICROSEMI, LX1992-02W EVAL KIT Datasheet - Page 10

no-image

LX1992-02W EVAL KIT

Manufacturer Part Number
LX1992-02W EVAL KIT
Description
Manufacturer
MICROSEMI
Datasheet

Specifications of LX1992-02W EVAL KIT

Lead Free Status / Rohs Status
Supplier Unconfirmed
Copyright © 2000
Rev. 1.1b, 2005-03-03
DU
LM
A2
H
TM
N
E
8-Pin Miniature Shrink Outline Package (MSOP)
8-Pin Plastic MLP-Micro Exposed Pad
A3
Θ
A
D
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
D
G
C
B
L2
A
A1
L
L2
P
K
P A C K A G E D I M E N S I O N S
Internally Connected
together, but isolated
from all other terminals
Linfinity Microelectronics Division
e
D2
®
Microsemi
K
b
E2
M
L
Note:
D2
1. Dimensions do not include mold flash or
Dim
Dim
A1
A2
A3
E2
L2
D
Θ
A
E
K
b
e
L
G
M
A
B
C
D
H
K
N
P
J
L
protrusions;
0.155mm(.006”) on any side.
shall not include solder coverage.
High Efficiency LED Driver
P
RODUCTION
2.85
2.90
0.25
0.38
0.13
0.40
0.05
4.75
0.80
0.00
0.65
0.15
0.28
2.90
2.90
1.52
1.02
0.20
0.20
MIN
MIN
M
M
0
0.65 BSC
0.95 BSC
0.65 BSC
ILLIMETERS
ILLIMETERS
these
MAX
D
3.05
3.10
1.10
0.40
0.64
0.18
0.70
0.15
5.05
MAX
1.00
0.05
0.75
0.25
0.38
3.10
3.10
2.08
1.31
0.60
0.13
12°
ATA
*
shall
S
HEET
0.009
0.015
0.005
0.016
0.002
0.187
Lead dimension
.112
.114
MIN
0.031
0.000
0.025
0.005
0.011
0.114
0.114
0.060
0.040
0.008
0.008
not
MIN
0.025 BSC
0.037 BSC
0.025 BSC
0
I
NCHES
I
NCHES
exceed
0.043
0.160
0.025
0.007
0.027
0.006
0.198
MAX
.120
.122
LX1992
0.039
0.002
0.029
0.009
0.015
0.122
0.122
0.082
0.052
0.023
0.005
MAX
12°
*
Page 10