LV8760T-TLM-E ON Semiconductor, LV8760T-TLM-E Datasheet - Page 4

• Manufacturer Part Number: LV8760T-TLM-E
• Description: Motor / Motion / Ignition Controllers & Drivers PRINTER
• Manufacturer: ON Semiconductor

Specifications of LV8760T-TLM-E

• Motor Type: Half Bridge
• No. Of Outputs: 1
• Driver Case Style: TSSOP
• No. Of Pins: 20
• Operating Temperature Range: -20°C To +85°C
• Svhc: No SVHC (20-Jun-2011)
• Base Number: 8760
• Rohs Compliant: Yes
• Lead Free Status / Rohs Status: Details

Substrate Specifications (Substrate recommended for operation of LV8760T)
Cautions
Size
Material
Copper wiring density : L1 = 95% / L2 = 95%
1) The data for the case with the Exposed Die-Pad substrate mounted shows the values when 90% or more of the
2) For the set design, employ the derating design with sufficient margin.
3) After the set design, be sure to verify the design with the actual product.
(1)Maximum value 80% or less for the voltage rating
(2)Maximum value 80% or less for the current rating
(3)Maximum value 80% or less for the temperature rating
Exposed Die-Pad is wet.
Stresses to be derated include the voltage, current, junction temperature, power loss, and mechanical stresses such as
vibration, impact, and tension.
Accordingly, the design must ensure these stresses to be as low or small as possible.
The guideline for ordinary derating is shown below :
Confirm the solder joint state and verify also the reliability of solder joint for the Exposed Die-Pad, etc.
Any void or deterioration, if observed in the solder joint of these parts, causes deteriorated thermal conduction,
possibly resulting in thermal destruction of IC.
L1 : Copper wiring pattern diagram
: Glass epoxy
: 90mm × 90mm × 1.6mm (two-layer substrate [2S0P])
3.30
1.60
4.0
3.0
2.0
1.0
– 20
0
*1
*2
0
Ambient temperature, Ta – °C
LV8760T
20
Pd max – Ta
*1 With Exposed Die-Pad substrate
*2 Without Exposed Die-Pad
40
60
L2 : Copper wiring pattern diagram
80
1.72
0.83
100
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