M25P16-VMN3TPB Micron Technology Inc, M25P16-VMN3TPB Datasheet - Page 44

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M25P16-VMN3TPB

Manufacturer Part Number
M25P16-VMN3TPB
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of M25P16-VMN3TPB

Lead Free Status / Rohs Status
Compliant

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Package mechanical
In order to meet environmental requirements, Numonyx offers these devices in RoHS
compliant packages, which have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
Figure 27. VFQFPN8 (MLP8) 8-lead very thin fine pitch quad flat package no lead,
1. Drawing is not to scale.
2. The circle in the top view of the package indicates the position of pin 1.
B
E
6 × 5 mm, package outline
A
E1
2x
0.10 C B
A1
R1
A3
A
0.10 C A
D1
D
θ
A2
E2
aaa C A
C
ddd
L
D2
e
b
70-ME

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