LFEC3E-4F256C Lattice, LFEC3E-4F256C Datasheet - Page 146
LFEC3E-4F256C
Manufacturer Part Number
LFEC3E-4F256C
Description
IC FPGA 3.1KLUTS 160I/O 256-BGA
Manufacturer
Lattice
Datasheet
1.LFEC3E-5TN144C.pdf
(163 pages)
Specifications of LFEC3E-4F256C
Lead Free Status / Rohs Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFEC3E-4F256C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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Pinout Information
Lattice Semiconductor
LatticeECP/EC Family Data Sheet
Thermal Management
Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal
characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets.
Designers must complete a thermal analysis of their specific design to ensure that the device and package do not
exceed the junction temperature limits. Refer to the Thermal Management document to find the device/package
specific thermal values.
For Further Information
For further information regarding Thermal Management, refer to the following located on the Lattice website at
www.latticesemi.com.
• Thermal Management document
• Technical Note TN1052 - Power Estimation and Management for LatticeECP/EC and LatticeXP Devices
• Power Calculator tool included with Lattice’s ispLEVER design tool, or as a standalone download from
www.latticesemi.com/software
4-80
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