LFXP10E-3F256I Lattice, LFXP10E-3F256I Datasheet - Page 41
LFXP10E-3F256I
Manufacturer Part Number
LFXP10E-3F256I
Description
IC FPGA 9.7KLUTS 188I/O 256-BGA
Manufacturer
Lattice
Datasheet
1.LFXP3C-3T100C.pdf
(397 pages)
Specifications of LFXP10E-3F256I
Lead Free Status / Rohs Status
Contains lead / RoHS non-compliant
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Part Number:
LFXP10E-3F256I
Manufacturer:
Lattice Semiconductor Corporation
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© 2007 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
Absolute Maximum Ratings
1. Stress above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation of the
2. Compliance with the Lattice Thermal Management document is required.
3. All voltages referenced to GND.
4. All chip grounds are connected together to a common package GND plane.
5. Overshoot and undershoot of -2V to (V
November 2007
Recommended Operating Conditions
Supply Voltage V
Supply Voltage V
Supply Voltage V
Supply Voltage V
Output Supply Voltage V
I/O Tristate Voltage Applied
Dedicated Input Voltage Applied
Storage Temperature (Ambient) . . . . . . . . . . . . . . -65 to 150°C . . . . . . . . . . . . . . . -65 to 150°C
Junction Temp. (Tj) . . . . . . . . . . . . . . . . . . . . . . . . . . +125°C . . . . . . . . . . . . . . . . . . . +125°C
V
V
V
V
V
t
t
t
t
1. If V
2. See recommended voltages by I/O standard in subsequent table.
3. The system designer must ensure that the FPGA design stays within the specified junction temperature and package thermal capabilities of
4. V
JCOM
JIND
JFLASHCOM
JFLASHIND
CC
CCP
CCAUX
CCIO
CCJ
device at these or any other conditions outside of those indicated in the operational sections of this specification is not implied.
Symbol
V
the device based on the expected operating frequency, activity factor and environment conditions of the system.
CCJ
CCAUX
1
CCIO
1, 2
4
is set to 1.2V, they must be connected to the same power supply as V
or V
ramp rate must not exceed 30mV/µs during power up when transitioning between 0V and 3.3V.
CCJ
Core Supply Voltage for 1.2V Devices
Core Supply Voltage for 1.8V/2.5V/3.3V Devices
Supply Voltage for PLL for 1.2V Devices
Supply Voltage for PLL for 1.8V/2.5V/3.3V Devices
Auxiliary Supply Voltage
I/O Driver Supply Voltage
Supply Voltage for IEEE 1149.1 Test Access Port
Junction Temperature, Commercial Operation
Junction Temperature, Industrial Operation
Junction Temperature, Flash Programming, Commercial
Junction Temperature, Flash Programming, Industrial
is set to 3.3V, they must be connected to the same power supply as V
CC
CCP
CCAUX
CCJ
. . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 1.32V . . . . . . . . . . . . . . . -0.5 to 3.75V
. . . . . . . . . . . . . . . . . . . . . . . -0.5 to 1.32V . . . . . . . . . . . . . . . -0.5 to 3.75V
. . . . . . . . . . . . . . . . . . . . . . . -0.5 to 3.75V . . . . . . . . . . . . . . . -0.5 to 3.75V
. . . . . . . . . . . . . . . . . . . . . -0.5 to 3.75V . . . . . . . . . . . . . . . -0.5 to 3.75V
CCIO
5
. . . . . . . . . . . . . . . . . -0.5 to 3.75V . . . . . . . . . . . . . . . -0.5 to 3.75V
. . . . . . . . . . . . . . . . -0.5 to 3.75V . . . . . . . . . . . . . . . -0.5 to 3.75V
5
IHMAX
. . . . . . . . . . . . . -0.5 to 3.75V . . . . . . . . . . . . . . . -0.5 to 4.25V
+ 2) volts is permitted for a duration of <20ns.
1, 2, 3, 4
DC and Switching Characteristics
Parameter
XPE (1.2V)
LatticeXP Family Data Sheet
3-1
3
CC
.
CCAUX.
For the XPE devices (1.2V V
XPC (1.8V/2.5V/3.3V)
DS1001
3.135
Min.
1.14
1.71
1.14
1.71
1.14
1.14
-40
0
0
0
DC and Switching_02.7
Data Sheet DS1001
3.465
3.465
3.465
3.465
3.465
Max.
1.26
1.26
100
85
85
85
CC
), if V
Units
CCIO
V
V
V
C
C
C
C
V
V
V
V
or
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