LFE2-20E-5FN256I Lattice, LFE2-20E-5FN256I Datasheet - Page 5

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LFE2-20E-5FN256I

Manufacturer Part Number
LFE2-20E-5FN256I
Description
IC FPGA 21KLUTS 193I/O 256FPBGA
Manufacturer
Lattice
Series
ECP2r

Specifications of LFE2-20E-5FN256I

Number Of Logic Elements/cells
21000
Number Of Labs/clbs
2625
Total Ram Bits
282624
Number Of I /o
193
Number Of Gates
-
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
256-BGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
220-1170
LFE2-20E-5FN256I
Q6411457

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LFE2-20E-5FN256I
Quantity:
1 831
Part Number:
LFE2-20E-5FN256I
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
QFNS
64-Pin QFNS
9 x 9 mm
0.90 mm height
0.50 mm pitch
48-Pin QFNS
7 x 7 mm
0.90 mm height
0.50 mm pitch
32-Pin QFNS
5 x 5 mm
0.85 mm height
0.50 mm pitch
24-Pin QFNS
4 x 4 mm
0.90 mm height
0.50 mm pitch
Chip Scale BGA
100-Ball csBGA
132-Ball csBGA
8 x 8 mm
1.23 mm height
0.50 mm pitch
144-Ball csBGA
7 x 7 mm
1.00 mm height
0.50 mm pitch
56-Ball csBGA
6 x 6 mm
1.23 mm height
0.50 mm pitch
64-Ball csBGA
5 x 5 mm
1.00 mm height
0.50 mm pitch
Ultra Chip Scale BGA
132-Ball ucBGA
6 x 6 mm
1.00 mm height
0.40 mm pitch
64-Ball ucBGA
4 x 4 mm
1.00 mm height
0.40 mm pitch
TQFP/PQFP
208-Pin PQFP
28 x 28 mm (body)
3.40 mm height
0.50 mm pitch
176-Pin TQFP
24 x 24 mm (body)
1.40 mm height
0.50 mm pitch
144-Pin TQFP
20 x 20 mm (body)
1.40 mm height
0.50 mm pitch
100-Pin TQFP
128-Pin TQFP
14 x 14 mm (body)
1.4 mm height
0.50 mm pitch (100 TQFP)
0.40 mm pitch (128 TQFP)
44-Pin TQFP
64-Pin TQFP
10 x 10 mm (body)
1.00 mm height (44 TQFP)
1.40 mm height (44 TQFP)
1.40 mm height (64 TQFP)
0.80 mm pitch (44 TQFP)
0.50 mm pitch (64 TQFP)
48-Pin TQFP
7 x 7 mm (body)
1.00 mm height
1.40 mm height
0.50 mm pitch
Wafer Level Chip Scale
49-Ball WLCSP
3.1 x 3.1 mm
0.59 mm height
0.40 mm pitch
25-Ball WLCSP
2.5 x 2.5 mm
0.59 mm height
0.40 mm pitch
Note: Packages shown actual size.
RoHS Compliant
and Halogen-Free
Packaging
Lattice Semiconductor is a leader in the
development of lead-free and halogen-
free packaging solutions. Both are RoHS
compliant.
For further information, see the RoHS
Compliant Packaging web page at:
www.latticesemi.com/rohs.
Users requiring leaded packaging are
requested to contact their local Lattice
sales office.
Package Diagrams
For detailed package schematics, down-
load the Package Diagrams document at
www.latticesemi.com/packaging.
Reflow Guidelines &
Moisture Sensitivity
For information on solder reflow and re-
work processes for Lattice surface mount
products, download TN1076, Solder
Reflow Guide for Surface Mount Devices
from the Lattice web site at
www.latticesemi.com/solderreflow.
Board Layout
Recommendations
TN1074, PCB Layout Recommendations
for BGA Packages, describes some of the
most common problems encountered
when working with BGA packages and
provides tips for avoiding them at the
design stage. Download TN1074 from the
Lattice web site at www.latticesemi.com/
boardlayout.
For more information and design examples
see the PCB Design Support web page at
www.latticesemi.com/pcbdesignsupport.
Page 5

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