LFXP20C-4FN256I Lattice, LFXP20C-4FN256I Datasheet - Page 378

• Manufacturer Part Number: LFXP20C-4FN256I
• Description: IC FPGA 19.7KLUTS 188I/O 256-BGA
• Manufacturer: Lattice

Specifications of LFXP20C-4FN256I

• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Lattice Semiconductor
Figure 14-1. BGA Breakout Routing Terms
Lattice provides BGA breakout and routing examples for various fine pitch packages
port/pcbdesignsupport/bgabreakoutroutingexample/index.cfm). Each package example is built to comply with
IPC7351 (www.ipc.org) specifications and nomenclature conventions. Some examples include different layout
options depending on design and cost goals. For example, the 256-ball chip array BGA (BN256) examples demon-
strate a design with fully-utilized I/Os, fine trace width and pitch, on a 6-layer PCB stack-up and a less expensive
design with relaxed design rules, and fewer I/O pads routed, on a 4-layer PCB stack up.
Table 14-3. Package Layout Example Summary
For mechanical dimension details on packages, see the Lattice
In order to show how some of the routing challenges are solved, examples are provided for fine-pitch BGA pack-
ages from the MachXO™ and the ispMACH
packaged products.
Package
UMN64
MN100
MN132
MN144
BN256
MN64
Example #
1
1
2
1
2
1
2
1
2
1
Pitch (mm)
0.5
0.4
0.5
0.5
0.5
0.5
0.5
0.5
0.8
0.8
Signal/
Layers
Power
6
6
4
4
4
4
6
4
6
4
®
4000ZE families. Principles for these apply to other Lattice BGA
Space (mm)
.100/.100
.100/.100
.085/.085
.100/.100
.085/.085
.100/.100
.100/.100
.100/.100
.100/.100
.100/.100
Width-
Trace/
14-3
Package Diagrams
Ball Pad
(mm)
.23
.18
.23
.23
.23
.23
.23
.23
.35
.35
PCB Layout Recommendations
Ball Mask
(mm)
.33
.28
.38
.38
.38
.38
.33
.38
.50
.50
document.
(www.latticesemi.com/sup-
for BGA Packages
Via Pad
(mm)
.30
.25
.45
.45
.40
.40
.30
.30
.40
.40
Via Drill
(mm)
.125
.125
.125
.125
.10
.20
.20
.15
.15
.15