LFX200EB-03F256C Lattice, LFX200EB-03F256C Datasheet - Page 27
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LFX200EB-03F256C
Manufacturer Part Number
LFX200EB-03F256C
Description
IC FPGA 200K GATES 256-BGA
Manufacturer
Lattice
Datasheet
1.LFX125EB-03F256I.pdf
(119 pages)
Specifications of LFX200EB-03F256C
Lead Free Status / Rohs Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFX200EB-03F256C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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Lattice Semiconductor
Supply Current
I
I
I
I
1. T
2. I
3. T
4. T
5. T
Symbol
CC
CCO
CCP
CCJ
in ispXPGA
1, 2
CC
A
A
A
A
5
4
3
= 25°C, frequency = 1.0 MHz, device configured with 16-bit counters.
= 25°C, per bank, no DC load, frequency = 0 MHz.
= 25°C, per PLL, frequency = 10 MHz.
= 25°C
varies with specific device configuration and operating frequency. For more accurate power calculation, see TN1043,
Standby Core Operating Power Supply Current
Standby Output Power Supply Current
Standby PLL Operating Supply Current
Standby IEEE 1149.1 TAP Power Supply Current
Devices.
Parameter
Over Recommended Operating Conditions
LFX125
LFX200
LFX500
LFX1200
Device
23
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CCO
CCO
CCO
CCO
CCP
CCP
CCP
CCJ
CCJ
CCJ
Condition
= 3.3V
= 2.5V
= 1.8V
= 3.3V
= 2.5V
= 1.8V
= 3.3V
= 2.5V
= 1.8V
= 3.3V
= 2.5V
= 1.8V
= 3.3V
= 2.5V
= 1.8V
= 3.3V
= 2.5V
= 1.8V
= 3.3V
= 2.5V
= 1.8V
= 1.5V
ispXPGA Family Data Sheet
Min.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ.
17.0
17.0
15.0
120
120
100
220
220
200
2.0
2.0
2.0
2.0
2.0
1.5
1.0
60
60
40
70
70
50
Power Estimation
Max.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
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