B32923C3155M000 EPCOS Inc, B32923C3155M000 Datasheet - Page 10

• Manufacturer Part Number: B32923C3155M000
• Description: Suppression Film Capacitors 1.5uF 305V 20% 22.5mm L/S Class X2
• Manufacturer: EPCOS Inc
• Series: B32923Cr

Specifications of B32923C3155M000

• Capacitance: 1.5 uF
• Tolerance: 20 %
• Voltage Rating: 305 Volts
• Termination Style: Radial
• Lead Spacing: 22.5 mm
• Dimensions: 12 mm W x 26.5 mm L x 22 mm H
• Operating Temperature Range: 0 C to + 125 C
• Product: Metallized Polypropylene Suppression Capacitors
• Lead Free Status / Rohs Status: Details

1.3
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Uncoated capacitors
For uncoated MKT capacitors with lead spacings 10 mm (B32560/B32561) the following mea-
sures are recommended:
Please read Cautions and warnings and
Important notes at the end of this document.
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
Pre-heating with a maximum temperature of 110 C
Temperature inside the capacitor should not exceed the following limits:
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
pre-heating to not more than 110 C in the preheater phase
rapid cooling after soldering
MKP/MFP 110 C
MKT 160 C
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General notes on soldering
B32921C/D ... B32926C/D
X2 / 305 V AC
max
. Long exposure to temperatures above this type-related temperature limit
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