MT47H64M8B6-3 L:D Micron Technology Inc, MT47H64M8B6-3 L:D Datasheet - Page 21

• Manufacturer Part Number: MT47H64M8B6-3 L:D
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H64M8B6-3 L:D

• Organization: 64Mx8
• Density: 512Mb
• Address Bus: 16b
• Access Time (max): 450ps
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: 0C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 180mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Compliant

Figure 9: 84-Ball FBGA (10mm x 12.5mm) – x16
PDF: 09005aef82f1e6e2
Rev. M 9/08 EN
Seating plane
Solder ball diameter
refers to post reflow
condition.
0.12 C
84X Ø0.45
11.2
C
Note:
1. All dimensions are in millimeters.
10.0 ±0.15
TYP
6.4
0.8
C L
C L
0.8 TYP
Ball A1 ID
0.8 ±0.1
21
12.5 ±0.15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.20 MAX
512Mb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID location
Packaging