HBLXT9785HE.C2 Intel, HBLXT9785HE.C2 Datasheet - Page 216
![no-image](/images/manufacturer_photos/0/3/336/intel_sml.jpg)
HBLXT9785HE.C2
Manufacturer Part Number
HBLXT9785HE.C2
Description
Manufacturer
Intel
Datasheet
1.HBLXT9785HE.C2.pdf
(221 pages)
Specifications of HBLXT9785HE.C2
Lead Free Status / Rohs Status
Not Compliant
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LXT9785/LXT9785E
Datasheet
249241, Revision 11.0
16 April 2007
Figure 68
Table 104
Cortina Systems
196-Ball BGA15 Package – Bottom View (LXT9785MBC )
196-Ball BGA15 Package Dimensions (LXT9785MBC )
®
Note:
Symbol
LXT9785 and LXT9785E Advanced 8-Port 10/100 Mbps PHY Transceivers
A1
A2
D1
E1
D
M
A
E
e
J
b
c
e
I
All dimensions and tolerances conform to ANSI Y14.5-
1982.Dimension is measured at maximum solder ball diameter
parallel to primary datum (-C-). Primary datum (-C-) and seating
plane are defined by the spherical crowns of the solder balls.
Min
1.00 (solder ball pitch)
1.00 REF.
1.00 REF.
14 x 14 Matrix
14.90
12.80
14.90
12.80
1.62
0.30
0.80
0.40
0.52
Nominal
15.00
13.00
15.00
13.00
1.81
0.40
0.85
0.50
0.56
1.00
15.10
13.20
15.10
13.20
Max
2.00
0.50
0.90
0.60
0.60
Units
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
8.0 Package Specifications
Page 216
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