AT24C512C-SSHM-T Atmel, AT24C512C-SSHM-T Datasheet - Page 21

• Manufacturer Part Number: AT24C512C-SSHM-T
• Manufacturer: Atmel

Specifications of AT24C512C-SSHM-T

• Lead Free Status / Rohs Status: Compliant

21
8U2-1 – dBGA2
Atmel AT24C512C
Notes:
Notes:
A1 BALL
PAD
CORNER
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.
1. This drawing is for general
1. This drawing is for general
2. Dimension 'b' is measured at the maximum solder ball diameter.
2. Dimension 'b' is measured at the maximum solder ball diameter.
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Package Drawing Contact:
TOP VIEW
D
d 0.10
A
B
E
TITLE
8U2-1, 8-ball, 2.35 x 3.73 mm Body,
0.75 mm pitch, VFBGA Package (dBGA2)
(4X)
SIDE VIEW
f 0.10 C
C
d 0.08 C
A1
A2
A
j n0.15 m C A B
j n0.08 m C
Øb
SYMBOL
A
A1
A2
b
D
E
e
e1
d
d1
e
COMMON DIMENSIONS
(Unit of Measure = mm)
(e1)
0.81 0.91 1.00
0.15 0.20 0.25
0.40 0.45 0.50
0.25 0.30 0.35
MIN
GPC
GWW
A1 BALL PAD CORNER
BOTTOM VIEW
2.35 BSC
3.73 BSC
0.75 BSC
0.74 REF
0.75 BSC
0.80 REF
8 SOLDER BALLS
NOM
DRAWING NO.
2
8U2-1
1
MAX
(d1)
8720A–SEEPR–9/10
d
A
B
C
D
NOTE
07/23/10
REV.
E