LF156H National Semiconductor, LF156H Datasheet - Page 2

• Manufacturer Part Number: LF156H
• Description: Op Amps
• Manufacturer: National Semiconductor
• Type: General Purpose Amplifierr

Specifications of LF156H

• Rail/rail I/o Type: No
• Number Of Elements: 1
• Unity Gain Bandwidth Product: 5MHz
• Slew Rate: 12V/us
• Common Mode Rejection Ratio: 85dB
• Input Offset Voltage: 5mV
• Input Bias Current: 100pA
• Single Supply Voltage (typ): Not RequiredV
• Power Dissipation: 1.2W
• Voltage Gain In Db: 106.02dB
• Power Supply Rejection Ratio: 85dB
• Power Supply Requirement: Dual
• Shut Down Feature: No
• Single Supply Voltage (min): Not RequiredV
• Single Supply Voltage (max): Not RequiredV
• Dual Supply Voltage (max): ±22V
• Technology: BiFET
• Operating Temp Range: -55C to 125C
• Operating Temperature Classification: Military
• Mounting: Through Hole
• Pin Count: 8
• Package Type: TO-99
• Number Of Channels: 1
• Voltage Gain Db: 106.02 dB
• Common Mode Rejection Ratio (min): 85 dB
• Supply Current: 7 mA at +/- 15 V
• Maximum Power Dissipation: 1200 mW
• Maximum Operating Temperature: + 125 C
• Package / Case: TO-99
• Maximum Dual Supply Voltage: +/- 22 V
• Minimum Operating Temperature: - 55 C
• Lead Free Status / Rohs Status: Not Compliant

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V
I
OS
V
TC/ V
OS
Symbol
Absolute Maximum Ratings
If Military/Aerospace specified devices are required, contact the National Semiconductor Sales Office/Distributors for
availability and specifications.
DC Electrical Characteristics
(Note 3)
OS
/ T
OS
Input Offset Voltage
Average TC of Input
Offset Voltage
Change in Average TC
with V
Input Offset Current
Supply Voltage
Differential Input Voltage
Input Voltage Range (Note 2)
Output Short Circuit Duration
T
Power Dissipation at T
1, 8)
Thermal Resistance (Typical)
(Typical)
Storage Temperature Range
Soldering Information (Lead Temp.)
See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of
soldering surface mount devices.
ESD tolerance
JMAX
H-Package
N-Package
M-Package
H-Package (Still Air)
H-Package (400 LF/Min Air Flow)
N-Package
M-Package
H-Package (Still Air)
H-Package (400 LF/Min Air Flow)
N-Package
M-Package
H-Package
Metal Can Package
Dual-In-Line Package
Small Outline Package
(100 pF discharged through 1.5k )
Soldering (10 sec.)
Soldering (10 sec.)
Vapor Phase (60 sec.)
Infrared (15 sec.)
OS
Parameter
Adjust
JC
A
= 25˚C (Notes
R
Over Temperature
R
R
T
T
J
J
S
S
S
=25˚C, (Notes 3, 5)
=50 , T
=50
=50 , (Note 4)
T
HIGH
Conditions
JA
A
(Note 1)
=25˚C
−65˚C to +150˚C
Continuous
1200 mW
160˚C/W
560 mW
LF155/6
1000V
65˚C/W
23˚C/W
150˚C
300˚C
260˚C
±
±
±
Min
22V
40V
20V
2
LF155/6
Typ
0.5
3
5
3
Max Min
LF256/7/LF356B
−65˚C to +150˚C
20
20
5
7
Continuous
1000 mW
160˚C/W
130˚C/W
195˚C/W
400 mW
670 mW
380 mW
65˚C/W
23˚C/W
1000V
115˚C
100˚C
100˚C
300˚C
260˚C
215˚C
220˚C
±
±
±
22V
40V
20V
LF256/7
LF356B
Typ
0.5
3
5
3
Max Min
6.5
20
−65˚C to +150˚C
5
1
Continuous
LF355/6/7
1000 mW
160˚C/W
130˚C/W
195˚C/W
400 mW
670 mW
380 mW
65˚C/W
23˚C/W
1000V
100˚C
100˚C
300˚C
260˚C
215˚C
220˚C
115˚C
±
±
±
18V
30V
16V
LF355/6/7
Typ
0.5
3
5
3
Max
10
13
50
2
per mV
µV/˚C
µV/˚C
Units
mV
mV
pA
nA